D82C55A-2 datasheet, PDF - EEWORLD Datasheet

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D82C55A-2: DescriptionParallel I/O Port, 24 I/O, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size618KB，21 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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D82C55A-2 Overview

Parallel I/O Port, 24 I/O, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40

D82C55A-2 Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	40
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	R-CDIP-T40
length	52.324 mm
Number of I/O lines	24
Number of ports	3
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.715 mm
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches	1

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D82C55A-2 Related Products

	D82C55A-2	ID82C55A	ID82C55A-2	P82C55A-2	D82C55A	P82C55A
Description	Parallel I/O Port, 24 I/O, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	Parallel I/O Port, 24 I/O, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	Parallel I/O Port, 24 I/O, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	Parallel I/O Port, 24 I/O, CMOS, PDIP40, PLASTIC, DIP-40	Parallel I/O Port, 24 I/O, CMOS, CDIP40, HERMETIC SEALED, CERAMIC, DIP-40	Parallel I/O Port, 24 I/O, CMOS, PDIP40, PLASTIC, DIP-40
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP,	HERMETIC SEALED, CERAMIC, DIP-40	DIP,	PLASTIC, DIP-40	DIP,	PLASTIC, DIP-40
Contacts	40	40	40	40	40	40
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
JESD-30 code	R-CDIP-T40	R-CDIP-T40	R-CDIP-T40	R-PDIP-T40	R-CDIP-T40	R-PDIP-T40
length	52.324 mm	52.324 mm	52.324 mm	52.2605 mm	52.324 mm	52.2605 mm
Number of I/O lines	24	24	24	24	24	24
Number of ports	3	3	3	3	3	3
Number of terminals	40	40	40	40	40	40
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	5.715 mm	5.715 mm	5.461 mm	5.715 mm	5.461 mm
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE
Maker	-	AMD	-	AMD	AMD	AMD

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