DP802514-1V datasheet, PDF - EEWORLD Datasheet

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DP802514-1V: DescriptionSPECIALTY MEMORY CIRCUIT, PQCC32, PLASTIC, LCC-32; Categorystorage storage; File Size133KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DP802514-1V Overview

SPECIALTY MEMORY CIRCUIT, PQCC32, PLASTIC, LCC-32

DP802514-1V Parametric

Parameter Name	Attribute value
package instruction	QCCJ,
Reach Compliance Code	unknown
JESD-30 code	R-PQCC-J32
length	13.995 mm
memory density	262144 bit
Memory IC Type	MEMORY CIRCUIT
memory width	8
Number of functions	1
Number of terminals	32
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	11.455 mm
Base Number Matches	1

DP802514-1V Related Products

	DP802514-1V	DP802515-1V	DP802515-1N	DP802514-1N
Description	SPECIALTY MEMORY CIRCUIT, PQCC32, PLASTIC, LCC-32	SPECIALTY MEMORY CIRCUIT, PQCC32, PLASTIC, LCC-32	SPECIALTY MEMORY CIRCUIT, PDIP28, 0.600 INCH, PLASTIC, DIP-28	SPECIALTY MEMORY CIRCUIT, PDIP28, 0.600 INCH, PLASTIC, DIP-28
package instruction	QCCJ,	QCCJ,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-PQCC-J32	R-PQCC-J32	R-PDIP-T28	R-PDIP-T28
length	13.995 mm	13.995 mm	35.725 mm	35.725 mm
memory density	262144 bit	262144 bit	262144 bit	262144 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	28	28
word count	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	32KX8	32KX8	32KX8	32KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.56 mm	3.56 mm	5.334 mm	5.334 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL	DUAL
width	11.455 mm	11.455 mm	15.24 mm	15.24 mm

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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