16Mx8, 7.5 - 15ns, P12, M-Densus
30A181-22
G
128 Megabit Synchronous DRAM
DPSD16MX8RY5
High Density Memory Device
DESCRIPTION:
The
M-Densus
series is a family of interchangeable memory modules. The 128 Megabit SDRAM is a member of
this family which utilizes the new and innovative space saving TSOP stacking technology. The modules are
constructed with 16 Meg x 4 SDRAMs.
This 64 Megabit based
M-Densus
module, the DPSD16MX8RY5 has been designed to fit in the same footprint as the
16 Meg x 8 SDRAM TSOP monolithic and 64 Megabit SDRAM based family of
M-Densus
modules. This allows the
memory board designer to upgrade the memory in their products without redesigning the memory board, thus
saving time and money.
PIN-OUT DIAGRAM
FEATURES:
•
Configuration Available:
16 Meg x 8 (4M x 4 x 8 bits)
•
Clock Frequency:
66
[1]
, 83
[1]
, 100, 125
[2]
, 133
[2]
MHz (max.)
•
PC100 and PC133 Compatable
•
3.3V Supply
•
LVTTL Compatible I/O
•
Four Bank Operation
•
Programmable Burst Type, Burst Length,
and CAS Latency
•
4096 Cycles / 64 ms
•
Auto and Self Refresh
•
Package: TSOP Leadless Stack
NOTES: [1] Available in Military and Industrial Temperature Ranges Only.
[2] Available in Commercial Temperature Range Only.
M-Densus
PIN NAMES
A0 - A11
BA0, BA1
DQ0 - DQ7
CAS
RAS
WE
DQM
CKE
CLK
CS
V
CC
/V
SS
V
CCQ
/V
SSQ
N.C.
30A181-22
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Row Address:
A0 - A11
Column Address: A0 - A9
Bank Select Address
Data In / Data Out
Column Address Strobes
Row Address Enables
Data Write Enable
Data Input/Output Mask
Clock Enable
System Clock
Chip Select
Power Supply/Ground
Data Output Power/Ground
No Connect
FUNCTIONAL BLOCK DIAGRAM
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change products or specifications herein without prior notice.
1
DPSD16MX8RY5
M-Densus
ORDERING INFORMATION
Dense-Pac Microsystems, Inc.
NOTES: [1] Available in Military and Industrial Temperature Ranges Only.
[2] Available in Commercial Temperature Range Only.
[3] Contact your sales representative for supplier and manufacturer codes.
MECHANICAL DRAWING
Standard TSOP Pad Layout is acceptable, however, when possible, the
following Pad Layout is recommended for optimal manufacture and inspection.
See Application Note 53A001-00 for further information.
(714) 898-0007
7321 Lincoln Way, Garden Grove, California 92841-1431
(800) 642-4477
FAX: (714) 897-1772
http://www.dense-pac.com
30A181-22
REV. G
Dense-Pac Microsystems, Inc.
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