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DPZ1MX16NA3-10M

Description
Flash Module, 2MX8, 100ns, CPGA50, DENSE STACK, MODULE, HERMETIC SEALED, PGA-50
Categorystorage    storage   
File Size526KB,18 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPZ1MX16NA3-10M Overview

Flash Module, 2MX8, 100ns, CPGA50, DENSE STACK, MODULE, HERMETIC SEALED, PGA-50

DPZ1MX16NA3-10M Parametric

Parameter NameAttribute value
Parts packaging codePGA
package instructionDENSE STACK, MODULE, HERMETIC SEALED, PGA-50
Contacts50
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time100 ns
Other featuresAUTOMATIC WRITE
Spare memory width16
JESD-30 codeR-CPGA-P50
length25.146 mm
memory density16777216 bit
Memory IC TypeFLASH MODULE
memory width8
Number of functions1
Number of terminals50
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2MX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeAPGA
Package shapeRECTANGULAR
Package formGRID ARRAY, PIGGYBACK
Parallel/SerialPARALLEL
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height7.4676 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
typeNOR TYPE
width13.716 mm
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