P89V664FBC datasheet, PDF - EEWORLD Datasheet

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P89V664FBC: Description8-bit 80C51 5 V low power 16 kB/32 kB/64 kB flash microcontroller with 512 B/1 kB/2 kB RAM, dual I2C-bus, SPI; CategoryThe embedded processor and controller Microcontrollers and processors; File Size346KB，89 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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P89V664FBC Overview

8-bit 80C51 5 V low power 16 kB/32 kB/64 kB flash microcontroller with 512 B/1 kB/2 kB RAM, dual I2C-bus, SPI

P89V664FBC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, SOT376-1, TQFP-44
Contacts	44
Reach Compliance Code	unknow
ECCN code	3A991.A.2
Has ADC	NO
Address bus width	16
bit size	8
CPU series	8051
maximum clock frequency	40 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQFP-G44
length	10 mm
Humidity sensitivity level	3
Number of I/O lines	36
Number of terminals	44
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TQFP
Encapsulate equivalent code	TQFP44,.47SQ,32
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	2048
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	40 MHz
Maximum slew rate	50 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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P89V660/662/664

8-bit 80C51 5 V low power 16 kB/32 kB/64 kB ﬂash

microcontroller with 512 B/1 kB/2 kB RAM, dual I

C-bus, SPI

Rev. 03 — 10 November 2008

Product data sheet

1. General description

The P89V660/662/664 are 80C51 microcontrollers with 16 kB/32 kB/64 kB ﬂash and

512 B/1 kB/2 kB of data RAM. These devices are designed to be drop-in and software

compatible replacements for the P89C660/662/664 devices. Both the In-System

Programming (ISP) and In-Application Programming (IAP) boot codes are upward

compatible.

Additional features of the P89V660/662/664 devices when compared to the

P89C660/662/664 devices are the inclusion of a secondary 100 kHz byte-wide I

C-bus

interface, an SPI interface, four addition I/O pins (Port 4), and the ability to erase code

memory in 128-byte pages.

The IAP capability combined with the 128-byte page size allows for efﬁcient use of the

code memory for non-volatile data storage.

2. Features

2.1 Principal features

Dual 100 kHz byte-wide I

C-bus interfaces

128-byte page erase for efﬁcient use of code memory as non-volatile data storage

0 MHz to 40 MHz operating frequency in 12x mode, 20 MHz in 6x mode

16 kB/32 kB/64 kB of on-chip ﬂash user code memory with ISP and IAP

512 B/1 kB/2 kB RAM

SPI (Serial Peripheral Interface) and enhanced UART

PCA (Programmable Counter Array) with PWM and Capture/Compare functions

Three 16-bit timers/counters

Four 8-bit I/O ports, one 4-bit I/O port

WatchDog Timer (WDT)

2.2 Additional features

30 ms page erase, 150 ms block erase

Support for 6-clock (default) or 12-clock mode selection via ISP or parallel programmer

PLCC44 and TQFP44 packages

Ten interrupt sources with four priority levels

Second DPTR register

Low EMI mode (ALE inhibit)

Power-down mode with external interrupt wake-up

P89V664FBC Related Products

	P89V664FBC	P89V660_0811	P89V662	P89V664	P89V660	P89V660FA	P89V662FBC	P89V664FA	P89V662FA
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Is it Rohs certified?	conform to	-	-	-	-	conform to	conform to	conform to	conform to
Maker	NXP	-	-	-	-	NXP	NXP	NXP	NXP
Parts packaging code	QFP	-	-	-	-	LPCC	QFP	LPCC	LPCC
package instruction	10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, SOT376-1, TQFP-44	-	-	-	-	PLASTIC, MS-018, SOT187-2, LCC-44	TQFP, TQFP44,.47SQ,32	PLASTIC, MS-018, SOT187-2, LCC-44	PLASTIC, MS-018, SOT187-2, LCC-44
Contacts	44	-	-	-	-	44	44	44	44
Reach Compliance Code	unknow	-	-	-	-	unknow	compli	unknow	unknow
ECCN code	3A991.A.2	-	-	-	-	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Has ADC	NO	-	-	-	-	NO	NO	NO	NO
Address bus width	16	-	-	-	-	16	16	16	16
bit size	8	-	-	-	-	8	8	8	8
CPU series	8051	-	-	-	-	8051	8051	8051	8051
maximum clock frequency	40 MHz	-	-	-	-	40 MHz	40 MHz	40 MHz	40 MHz
DAC channel	NO	-	-	-	-	NO	NO	NO	NO
DMA channel	NO	-	-	-	-	NO	NO	NO	NO
External data bus width	8	-	-	-	-	8	8	8	8
JESD-30 code	S-PQFP-G44	-	-	-	-	S-PQCC-J44	S-PQFP-G44	S-PQCC-J44	S-PQCC-J44
length	10 mm	-	-	-	-	16.585 mm	10 mm	16.585 mm	16.585 mm
Humidity sensitivity level	3	-	-	-	-	1	3	3	3
Number of I/O lines	36	-	-	-	-	36	36	36	36
Number of terminals	44	-	-	-	-	44	44	44	44
Maximum operating temperature	85 °C	-	-	-	-	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-	-	-	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	-	-	-	-	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	-	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TQFP	-	-	-	-	QCCJ	TQFP	QCCJ	QCCJ
Encapsulate equivalent code	TQFP44,.47SQ,32	-	-	-	-	LDCC44,.7SQ	TQFP44,.47SQ,32	LDCC44,.7SQ	LDCC44,.7SQ
Package shape	SQUARE	-	-	-	-	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, THIN PROFILE	-	-	-	-	CHIP CARRIER	FLATPACK, THIN PROFILE	CHIP CARRIER	CHIP CARRIER
Peak Reflow Temperature (Celsius)	260	-	-	-	-	245	260	245	245
power supply	5 V	-	-	-	-	5 V	5 V	5 V	5 V
Certification status	Not Qualified	-	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	2048	-	-	-	-	512	1024	2048	1024
rom(word)	65536	-	-	-	-	16384	32768	65536	32768
ROM programmability	FLASH	-	-	-	-	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.2 mm	-	-	-	-	4.57 mm	1.2 mm	4.57 mm	4.57 mm
speed	40 MHz	-	-	-	-	40 MHz	40 MHz	40 MHz	40 MHz
Maximum slew rate	50 mA	-	-	-	-	50 mA	50 mA	50 mA	50 mA
Maximum supply voltage	5.5 V	-	-	-	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	-	-	-	-	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	-	-	-	-	5 V	5 V	5 V	5 V
surface mount	YES	-	-	-	-	YES	YES	YES	YES
technology	CMOS	-	-	-	-	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	-	-	-	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	-	-	-	-	J BEND	GULL WING	J BEND	J BEND
Terminal pitch	0.8 mm	-	-	-	-	1.27 mm	0.8 mm	1.27 mm	1.27 mm
Terminal location	QUAD	-	-	-	-	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	-	-	-	-	40	30	40	30
width	10 mm	-	-	-	-	16.585 mm	10 mm	16.585 mm	16.585 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	-	-	-	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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