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SMBJ5226B

Description
Zener Diode, 3.3V V(Z), 5%, 1W, Silicon, Unidirectional, DO-214AA, SMBJ, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size79KB,2 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

SMBJ5226B Overview

Zener Diode, 3.3V V(Z), 5%, 1W, Silicon, Unidirectional, DO-214AA, SMBJ, 2 PIN

SMBJ5226B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDO-214AA
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance28 Ω
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-C2
JESD-609 codee0
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1 W
Certification statusNot Qualified
Nominal reference voltage3.3 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current20 mA
Base Number Matches1
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax (480) 947-1503
SMBJ5221
thru
SMBJ5281
FEATURES:
Popular SMBJ Package - Small and Rugged Surface Mount
Constructed with an Oxide Passivated Die
Voltage Range 2.4 to 200 Volts
Tight Tolerance Available
SILICON
1 WATT
ZENER DIODES
MAXIMUM RATINGS:
Operating & Storage Temperature: -55° C to +150° C
°
°
DC Power Dissipation: 1 Watt
Power Derating: 20 mW/° C above 100° C
°
°
Forward voltage @ 200mA: 1.1V
SMBJ
MECHANICAL CHARACTERISTICS:
CASE
:
DO-214AA Molded Surface Mountable with flame retardant epoxy
meeting UL94V-0
Terminals:
C-bend (modified J-bend) leads, tin lead plated.
Polarity:
Cathode indicated by band.
Packaging:
Standard 12mm tape (see EIA Std. RS-481).
THERMAL RESISTANCE:
50° C/ Watt (typical) junction to lead (tab) at
°
mounting plane.
MAXIMUM TEMPERATURE FOR SOLDERING:
260° C for 10 seconds.
°
1200
P
d
RATED POWER DISSIPATION (mW)
1000
MIN.
MAX.
MIN.
MAX.
800
600
Dimensions in Inches
A
B
C
D
.077
.160
.130
.205
.083
.180
.155
.220
Dimensions in Millimeters
1.96
4.06
3.30
5.21
2.10
4.57
3.94
5.59
E
.075
.095
1.90
2.41
400
Modified J-Bend
0.089
200
0
+ 25
+ 50
+ 75
+ 100
+ 125
+ 150
+ 175
+ 200
0.108
T
L
LEAD TEMPERATURE AT MOUNTING PLANE
POWER DERATING CURVE
0.085
MSC1346.PDF
ISO 9001 CERTIFIED
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