5962-8685923ZA datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> 5962-8685923ZA

5962-8685923ZA: DescriptionSRAM, 16KX4, 35ns, CMOS, CQCC22, LCC-22; Categorystorage storage; File Size245KB，8 Pages; ManufacturerPyramid Semiconductor Corporation; Websitehttp://www.pyramidsemiconductor.com/

Download Datasheet Parametric Compare View All

5962-8685923ZA Overview

SRAM, 16KX4, 35ns, CMOS, CQCC22, LCC-22

5962-8685923ZA Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Pyramid Semiconductor Corporation
Parts packaging code	LCC
package instruction	QCCN, LCC22,.3X.5
Contacts	22
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	35 ns
I/O type	COMMON
JESD-30 code	R-CQCC-N22
length	12.445 mm
memory density	65536 bit
Memory IC Type	OTHER SRAM
memory width	4
Number of functions	1
Number of terminals	22
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX4
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC22,.3X.5
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Qualified
Filter level	MIL-STD-883
Maximum seat height	2.03 mm
Maximum standby current	0.001 A
Minimum standby current	2 V
Maximum slew rate	0.115 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.366 mm
Base Number Matches	1

Preview

Download Datasheet

View All

5962-8685923ZA Related Products

	5962-8685923ZA	5962-8685924ZA	P4C188-55LM	P4C188-55DM	P4C188L-55DM	P4C188L-55DMB	P4C188L-55LM	P4C188L-55LMB
Description	SRAM, 16KX4, 35ns, CMOS, CQCC22, LCC-22	SRAM, 16KX4, 35ns, CMOS, CQCC22, LCC-22	Standard SRAM, 16KX4, 55ns, CMOS, CQCC22, 0.290 X 0.490 INCH, HERMETIC SEALED, CERAMIC, LCC-22	Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22	Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22	Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, 0.300 INCH, CERDIP-22	Standard SRAM, 16KX4, 55ns, CMOS, CQCC22, 0.290 X 0.490 INCH, HERMETIC SEALED, CERAMIC, LCC-22	Standard SRAM, 16KX4, 55ns, CMOS, CQCC22, 0.290 X 0.490 INCH, HERMETIC SEALED, CERAMIC, LCC-22
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	LCC	LCC	LCC	DIP	DIP	DIP	LCC	LCC
package instruction	QCCN, LCC22,.3X.5	QCCN, LCC22,.3X.5	QCCN,	DIP,	DIP,	DIP,	QCCN,	QCCN,
Contacts	22	22	22	22	22	22	22	22
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	35 ns	35 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns
JESD-30 code	R-CQCC-N22	R-CQCC-N22	R-CQCC-N22	R-GDIP-T22	R-GDIP-T22	R-GDIP-T22	R-CQCC-N22	R-CQCC-N22
length	12.445 mm	12.445 mm	12.446 mm	27.559 mm	27.559 mm	27.559 mm	12.446 mm	12.446 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	OTHER SRAM	OTHER SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	22	22	22	22	22	22	22	22
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	QCCN	QCCN	DIP	DIP	DIP	QCCN	QCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Qualified	Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.03 mm	2.03 mm	1.905 mm	5.08 mm	5.08 mm	5.08 mm	1.905 mm	1.905 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.366 mm	7.366 mm	7.366 mm	7.62 mm	7.62 mm	7.62 mm	7.366 mm	7.366 mm
Maker	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	-	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation	Pyramid Semiconductor Corporation
JESD-609 code	-	-	e0	e0	e0	e0	e0	e0
Terminal surface	-	-	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD

Recommended Resources

Thyristor silicon stack protection circuitb

3823D53-010B switching regulator circuit diagram

Three-level passive lossless soft-switching PFC circuit topology

820e computer motherboard circuit diagram_58

Computer motherboard circuit diagram 440GX_07

Computer motherboard circuit diagram 815 1_11

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components