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IP3088CX5; IP3088CX10;
IP3088CX15; IP3088CX20
Integrated 2, 4, 6 and 8-channel passive LC-filter network with
ESD protection to IEC 61000-4-2 level 4
Rev. 01 — 12 February 2010
Product data sheet
1. Product profile
1.1 General description
IP3088CX5, IP3088CX10, IP3088CX15 and IP3088CX20 is a 2, 4, 6 and 8-channel LC
low-pass filter array family which is designed to provide filtering of undesired RF signals
on the I/O ports of portable communication or computing devices. In addition, IP3088CX5,
IP3088CX10, IP3088CX15 and IP3088CX20 incorporates diodes to provide protection to
downstream components from ElectroStatic Discharge (ESD) voltages as high as
±15
kV
according IEC 61000-4-2 level 4.
The devices are fabricated using monolithic silicon technology and integrate and
incorporate up to 16 coils and 24 diodes in a 0.5 mm pitch Wafer-Level Chip-Scale
Package (WLCSP).
1.2 Features and benefits
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
Integrated 2, 4, 6 and 8-channel
π-type
LC-filter network
18
Ω
channel series resistance;
≤
45 pF (at 2.5 V DC) channel capacitance
Integrated ESD protection withstanding
±15
kV contact discharge, far exceeding
IEC 61000-4-2 level 4
ESD protection to
±30
kV contact discharge, per MIL-STD-883D, Method 3 015
WLCSP with 0.5 mm pitch
1.3 Applications
Cellular and Personal Communication System (PCS) mobile handsets
Cordless telephones
Wireless data (WAN/LAN) systems and PDAs
NXP Semiconductors
IP3088CX5/CX10/CX15/CX20
2, 4, 6 and 8-channel passive LC-filter network with ESD protection
2. Pinning information
2.1 Pinning
bump A1
index area
1
A
B
C
001aak061
bump A1
index area
2
A
B1
B
C
001aak062
1
2
3
4
B1
B2
transparent top view,
solder balls facing down
transparent top view,
solder balls facing down
Fig 1.
Pin configuration IP3088CX5
bump A1
index area
1
A
B
C
001aak063
Fig 2.
Pin configuration IP3088CX10
bump A1
index area
2
3
4
5
6
A
B1
B2
B3
B
C
001aak064
1
2
3
4
5
6
7
8
B1
B2
B3
B4
transparent top view,
solder balls facing down
transparent top view,
solder balls facing down
Fig 3.
Pin configuration IP3088CX15
Fig 4.
Pin configuration IP3088CX20
2.2 Pin description
Table 1.
Pin
IP3088CX5
A1 and C1
A2 and C2
-
-
-
-
-
-
B1
IP3088CX10
A1 and C1
A2 and C2
A3 and C3
A4 and C4
-
-
-
-
B1 and B2
IP3088CX15
A1 and C1
A2 and C2
A3 and C3
A4 and C4
A5 and C5
A6 and C6
-
-
B1, B2 and B3
IP3088CX20
A1 and C1
A2 and C2
A3 and C3
A4 and C4
A5 and C5
A6 and C6
A7 and C7
A8 and C8
B1, B2, B3 and B4
filter channel 1
filter channel 2
filter channel 3
filter channel 4
filter channel 5
filter channel 6
filter channel 7
filter channel 8
ground
Pinning
Description
IP3088CX5_CX10_CX15_CX20_1
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 12 February 2010
2 of 15
NXP Semiconductors
IP3088CX5/CX10/CX15/CX20
2, 4, 6 and 8-channel passive LC-filter network with ESD protection
3. Ordering information
Table 2.
Ordering information
Package
Name
IP3088CX5
IP3088CX10
IP3088CX15
IP3088CX20
WLCSP5
WLCSP10
WLCSP15
WLCSP20
Description
wafer level chip-size package; 5 bumps; 0.96
×
1.28
×
0.65 mm
wafer level chip-size package; 10 bumps; 1.96
×
1.28
×
0.65 mm
wafer level chip-size package; 15 bumps; 2.96
×
1.28
×
0.65 mm
wafer level chip-size package; 20 bumps; 3.96
×
1.28
×
0.65 mm
Version
IP3088CX5
IP3088CX10
IP3088CX15
IP3088CX20
Type number
4. Functional diagram
A1 to A8
C1 to C8
B1 to B4
008aaa184
Fig 5.
Schematic diagram IP3088CX5; IP3088CX10; IP3088CX15; IP3088CX20
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CC
V
ESD
Parameter
supply voltage
electrostatic discharge voltage
all pins to ground
contact discharge
air discharge
IEC 61000-4-2 level 4; all pins
to ground
contact discharge
air discharge
MIL-STD-883D (method 3 015)
HBM contact discharge
I
ch
T
stg
T
amb
[1]
[1]
[1]
Conditions
Min
−0.5
−15
−15
Max
+5.6
+15
+15
Unit
V
kV
kV
−8
−15
−30
-
−65
−40
+8
+15
+30
30
+150
+85
kV
kV
kV
mA
°C
°C
channel current (DC)
storage temperature
ambient temperature
per inductor; T
amb
= 85
°C
Device is qualified with 1 000 pulses of
±15
kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the
specified level 4 (8 kV contact discharge).
IP3088CX5_CX10_CX15_CX20_1
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 12 February 2010
3 of 15
NXP Semiconductors
IP3088CX5/CX10/CX15/CX20
2, 4, 6 and 8-channel passive LC-filter network with ESD protection
6. Characteristics
Table 4.
Channel characteristics
T
amb
= 25
°
C; unless otherwise specified.
Symbol Parameter
R
s(ch)
L
s(ch)
C
ch
channel series resistance
channel series inductance
channel capacitance
V
bias(DC)
= 0 V;
f = 100 kHz
V
bias(DC)
= 2.5 V;
f = 100 kHz
V
BR
V
F
I
LR
[1]
[1]
Conditions
Min
-
-
-
-
5.8
−1.5
-
Typ
18
40
65
42
-
-
-
Max
-
-
-
-
10
−0.4
0.1
Unit
Ω
nH
pF
pF
V
V
μA
[1]
breakdown voltage
forward voltage
reverse leakage current
Guaranteed by design.
positive clamp;
I
test
= 1 mA
negative clamp;
I
F
=
−1
mA
per channel; V
I
= 3.5 V
Table 5.
Frequency characteristics
T
amb
= 25
°
C; unless otherwise specified.
Symbol Parameter
α
il
insertion loss
Conditions
R
gen
= 50
Ω;
R
L
= 50
Ω
800 MHz < f < 1.5 GHz
1.5 GHz < f < 3.0 GHz
f
−3dB
cut-off frequency
R
gen
= 50
Ω;
R
L
= 50
Ω;
V
bias(DC)
= 0 V;
α
il
at 1 MHz
−
3 dB
-
-
-
40
33
175
-
-
-
dB
dB
MHz
Min
Typ
Max
Unit
7. Application information
7.1 Insertion loss
IP3088CX5, IP3088CX10, IP3088CX15 and IP3088CX20 is mainly designed as an
ElectroMagnetic Interference (EMI) and Radio Frequency Interference (RFI) filter for
Subscriber Identity Module (SIM) card interfaces.
The setup for measuring insertion loss in a 50
Ω
system is shown in
Figure 6.
IN
50
Ω
DUT
OUT
50
Ω
TEST BOARD
Vgen
001aai755
Fig 6.
IP3088CX5_CX10_CX15_CX20_1
Frequency response measurement configuration
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 12 February 2010
4 of 15
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