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573400D00010

Description
Heat Sink, Fin,
CategoryThermal management products    Heat resisting bracing   
File Size49KB,2 Pages
ManufacturerBoyd Corporation
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573400D00010 Overview

Heat Sink, Fin,

573400D00010 Parametric

Parameter NameAttribute value
MakerBoyd Corporation
Reach Compliance Codecompliant
structureFIN
high10.2 mm
length31 mm
method of packingTAPE AND REEL
Heat Resistant Support Device TypeHEAT SINK
weight3.7 g
width12.7 mm
Base Number Matches1
T H E R M A L P R O D U C T S, I N C.
SURFACE MOUNT HEAT SINKS FOR
D-PAK, D
2
PAK AND D
3
PAK PACKAGES
THEORY OF OPERATION:
Heat from the D-PAK, D
2
PAK or D
3
PAK
device is removed indirectly through con-
duction – no direct contact is made to the
SMT device. Principally, the heat generated
by the D-PAK/D
2
PAK/D
3
PAK device is con-
ducted down into the PCB where it is
picked up by a copper drain pad. The drain
pad spreads the heat beyond the
edge of the package to the
point where the heat sink is
mounted to the PCB. The
heat is then conducted
into the copper heat sink
where it is dissipated
into the
surrounding
environment.
• Surface mountable heat sink
• Requires no attachment holes in circuit board
• Low weight: 2.3 grams (D-PAK/TO-252)
3.1 grams (D
2
PAK/TO-263)
3.7 grams (D
3
PAK/TO-268)
• Compatible with automated SMT assembly
operations
• Height of “wings” allows high component
density adjacent to heat sink
Aavid’s surface mount heat sinks come pre-packaged
in a tape & reel format. Dimensions on the tape are
available upon request from our Applications Engi-
neering department.
THERMAL PERFORMANCE
D-PAK
A I R F L OW ( L F M )
T H E R M A L R E S I S TA N C E C A S E - A M B I E N T ( C / W )
S M T D PA K W E B - D E S I G N
T E M P E R AT U R E R I S E A B OV E A M B I E N T ( Ø c a )
0
200
160
200
400
600
800
50
40
30
20
WITHOUT HEAT SINK
120
80
40
0
0
0.5
1.0
1.5
2.0
2.5
WITH HEAT SINK
10
0
3.0
Part Number
573100, 573300
and 573400
Patent Pending
P OW E R ( WAT T S )
THERMAL PERFORMANCE
D
2
PAK
S M T D
2
PA K W E B - D E S I G N
T E M P E R AT U R E R I S E A B OV E A M B I E N T ( Ø c a )
T H E R M A L R E S I S TA N C E C A S E - A M B I E N T ( C / W )
T E M P E R AT U R E R I S E A B OV E A M B I E N T ( Ø c a )
A I R F L OW ( L F M )
THERMAL PERFORMANCE
D
3
PAK
A I R F L OW ( L F M )
0
60
50
40
30
20
10
0
0
200
400
600
WITHOUT HEAT SINK
WITH HEAT SINK
0.5
1.0
1.5
800 1,000 1,200
30
25
20
15
10
5
0
2.0 2.5 3.0
45
35
25
100 200 300 400 500 600 700 800
20
WITHOUT HEAT SINK
15
10
WITH HEAT SINK
15
0
0
0.5
1.0
1.5
2.0
2.5
3.0
P OW E R ( WAT T S )
5
0
P OW E R ( WAT T S )
T H E R M A L R E S I S TA N C E C A S E - A M B I E N T ( C / W )
S M T D
3
PA K W E B - D E S I G N

573400D00010 Related Products

573400D00010 573400D00000
Description Heat Sink, Fin, Heat Sink, Fin,
Maker Boyd Corporation Boyd Corporation
Reach Compliance Code compliant unknown
structure FIN FIN
high 10.2 mm 10.2 mm
length 31 mm 31 mm
Heat Resistant Support Device Type HEAT SINK HEAT SINK
weight 3.7 g 3.7 g
width 12.7 mm 12.7 mm
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