IC,MONOSTABLE MULTIVIBRATOR,HC-CMOS,DIP,16PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-PDIP-T16 |
| Logic integrated circuit type | MONOSTABLE MULTIVIBRATOR |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 2/6 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| SN74HC423NP1 | SN74HC123N1 | SN74HC123NP1 | SN74HC423N1 | |
|---|---|---|---|---|
| Description | IC,MONOSTABLE MULTIVIBRATOR,HC-CMOS,DIP,16PIN,PLASTIC | IC,MONOSTABLE MULTIVIBRATOR,HC-CMOS,DIP,16PIN,PLASTIC | IC,MONOSTABLE MULTIVIBRATOR,HC-CMOS,DIP,16PIN,PLASTIC | IC,MONOSTABLE MULTIVIBRATOR,HC-CMOS,DIP,16PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
| Logic integrated circuit type | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR | MONOSTABLE MULTIVIBRATOR |
| Number of terminals | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |