FIFO, 64X9, 23ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 23 ns |
| period time | 40 ns |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e0 |
| length | 37.0205 mm |
| memory density | 576 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64X9 |
| Output characteristics | TOTEM POLE |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8966102XA | 5962-8966401XA | 5962-8966101XA | |
|---|---|---|---|
| Description | FIFO, 64X9, 23ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 | FIFO, 64X8, 40ns, Asynchronous, CMOS, CDIP28, CERAMIC, DIP-28 | FIFO, 64X9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, CERDIP-28 |
| Parts packaging code | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | DIP, |
| Contacts | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknow | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 23 ns | 40 ns | 40 ns |
| period time | 40 ns | 66.67 ns | 66.67 ns |
| JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
| JESD-609 code | e0 | e0 | e0 |
| length | 37.0205 mm | 37.0205 mm | 37.0205 mm |
| memory density | 576 bit | 512 bi | 576 bit |
| memory width | 9 | 8 | 9 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 |
| word count | 64 words | 64 words | 64 words |
| character code | 64 | 64 | 64 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 64X9 | 64X8 | 64X9 |
| Output characteristics | TOTEM POLE | 3-STATE | TOTEM POLE |
| Exportable | NO | YES | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| width | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 |
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