|
85C72/SN |
85C72-I/SN |
| Description |
128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
| Is it lead-free? |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
| Maker |
Microchip |
Microchip |
| Parts packaging code |
SOIC |
SOIC |
| package instruction |
0.150 INCH, PLASTIC, SOIC-8 |
0.150 INCH, PLASTIC, SOIC-8 |
| Contacts |
8 |
8 |
| Reach Compliance Code |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
| Other features |
AUTOMATIC WRITE; 2 WIRE INTERFACE |
AUTOMATIC WRITE; 2 WIRE INTERFACE |
| Maximum clock frequency (fCLK) |
0.1 MHz |
0.1 MHz |
| I2C control byte |
1010DDDR |
1010DDDR |
| JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
| JESD-609 code |
e3 |
e3 |
| length |
4.9 mm |
4.9 mm |
| memory density |
1024 bit |
1024 bit |
| Memory IC Type |
EEPROM |
EEPROM |
| memory width |
8 |
8 |
| Humidity sensitivity level |
1 |
1 |
| Number of functions |
1 |
1 |
| Number of terminals |
8 |
8 |
| word count |
128 words |
128 words |
| character code |
128 |
128 |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
| Maximum operating temperature |
70 °C |
85 °C |
| organize |
128X8 |
128X8 |
| Output characteristics |
OPEN-DRAIN |
OPEN-DRAIN |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SOP |
SOP |
| Encapsulate equivalent code |
SOP8,.25 |
SOP8,.25 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE |
SMALL OUTLINE |
| Parallel/Serial |
SERIAL |
SERIAL |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| power supply |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.75 mm |
1.75 mm |
| Serial bus type |
I2C |
I2C |
| Maximum standby current |
0.0001 A |
0.0001 A |
| Maximum slew rate |
0.007 mA |
0.0085 mA |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4 V |
4 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
INDUSTRIAL |
| Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
| Terminal form |
GULL WING |
GULL WING |
| Terminal pitch |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
40 |
40 |
| width |
3.9 mm |
3.9 mm |
| Maximum write cycle time (tWC) |
1 ms |
1 ms |
| Base Number Matches |
1 |
1 |