Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, CDIP20
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | not_compliant |
| Control type | COMMON CONTROL |
| Counting direction | BIDIRECTIONAL |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| MaximumI(ol) | 0.024 A |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 6 |
| translate | N/A |
| Base Number Matches | 1 |
| 74AHCT245D | 5962-01-292-1659 | 5962-01-292-1660 | IDT54AHCT245EB | 54AHCT245LB | 54AHCT245DB | |
|---|---|---|---|---|---|---|
| Description | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, CDIP20 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, CDIP20 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, CQCC20 | Bus Driver/Transceiver, 1-Func, 8-Bit, True Output, CMOS, CDFP20 | LCC-20, Tube | CDIP-20, Tube |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant | not_compliant |
| Control type | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL | COMMON CONTROL |
| Counting direction | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 code | R-XDIP-T20 | R-XDIP-T20 | S-XQCC-N20 | R-XDFP-F20 | S-XQCC-N20 | R-XDIP-T20 |
| MaximumI(ol) | 0.024 A | 0.014 A | 0.014 A | 0.014 A | 0.014 A | 0.014 A |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | QCCN | DFP | QCCN | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | FL20,.3 | LCC20,.35SQ | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER | IN-LINE |
| method of packing | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 240 | 240 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | 6 | 6 | 6 | 6 | NOT SPECIFIED | NOT SPECIFIED |
| translate | N/A | N/A | N/A | N/A | N/A | N/A |
| Maker | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| package instruction | DIP, DIP20,.3 | - | - | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 |
| JESD-609 code | e0 | - | - | e0 | e0 | e0 |
| Terminal surface | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Filter level | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
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