RC28F160C3BA90 datasheet, PDF - EEWORLD Datasheet

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RC28F160C3BA90: Description1M X 16 FLASH 3V PROM, 90 ns, PDSO48; Categorystorage storage; File Size680KB，68 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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RC28F160C3BA90 Overview

1M X 16 FLASH 3V PROM, 90 ns, PDSO48

RC28F160C3BA90 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
Parts packaging code	BGA
package instruction	TBGA, BGA64,8X8,40
Contacts	64
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	90 ns
Other features	USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B64
JESD-609 code	e0
length	13 mm
memory density	16777216 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,31
Number of terminals	64
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	1.8/3.3,3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Department size	4K,32K
Maximum standby current	0.000005 A
Maximum slew rate	0.055 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
switch bit	NO
type	NOR TYPE
width	10 mm

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Intel

Advanced+ Boot Block Flash

Memory (C3)

28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16)

Datasheet

Product Features

■

Flexible SmartVoltage Technology

— 2.7 V– 3.6 V Read/Program/Erase

— 12 V for Fast Production Programming

1.65 V–2.5 V or 2.7 V–3.6 V I/O Option

— Reduces Overall System Power

High Performance

— 2.7 V– 3.6 V: 70 ns Max Access Time

Optimized Architecture for Code Plus

Data Storage

— Eight 4 Kword Blocks, Top or Bottom

Parameter Boot

— Up to One Hundred-Twenty-Seven 32

Kword Blocks

— Fast Program Suspend Capability

— Fast Erase Suspend Capability

Flexible Block Locking

— Lock/Unlock Any Block

— Full Protection on Power-Up

— WP# Pin for Hardware Block Protection

Low Power Consumption

— 9 mA Typical Read

— 7 A Typical Standby with Automatic

Power Savings Feature (APS)

Extended Temperature Operation

— –40 °C to +85 °C

■

128-bit Protection Register

— 64 bit Unique Device Identifier

— 64 bit User Programmable OTP Cells

Extended Cycling Capability

— Minimum 100,000 Block Erase Cycles

Software

— Intel

Flash Data Integrator (FDI)

— Supports Top or Bottom Boot Storage,

Streaming Data (e.g., voice)

— Intel Basic Command Set

— Common Flash Interface (CFI)

Standard Surface Mount Packaging

— 48-Ball

µBGA*/VFBGA

— 64-Ball Easy BGA Packages

— 48-Lead TSOP Package

ETOX™ VIII (0.13

µm)

Flash

Technology

— 16, 32 Mbit

ETOX™ VII (0.18

µm)

Flash Technology

— 16, 32, 64 Mbit

ETOX™ VI (0.25

µm)

Flash Technology

— 8, 16 and 32 Mbit

The Intel

Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest

0.13

µm

and 0.18

µm

technologies, represents a feature-rich solution for low-power applications.

The C3 device incorporates low-voltage capability (3 V read, program, and erase) with high-

speed, low-power operation. Flexible block locking allows any block to be independently locked

or unlocked. Add to this the Intel

Flash Data Integrator (FDI) software and you have a cost-

effective, flexible, monolithic code plus data storage solution. Intel

Advanced+ Boot Block Flash

Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA

packages. Additional information on this product family can be obtained by accessing the Intel

Flash website: http://www.intel.com/design/flash.

Notice:

This specification is subject to change without notice. Verify with your local Intel sales

office that you have the latest datasheet before finalizing a design.

Order Number: 290645-017

October 2003

Contents

1.0

Introduction....................................................................................................................................7

1.1

1.2

1.3

2.0

2.1

2.2

2.3

2.4

2.5

3.0

3.1

Document Purpose ...............................................................................................................7

Nomenclature .......................................................................................................................7

Conventions..........................................................................................................................7

Product Overview .................................................................................................................8

Ballout Diagram ....................................................................................................................8

Signal Descriptions .............................................................................................................13

Block Diagram ....................................................................................................................14

Memory Map .......................................................................................................................15

Bus Operations ...................................................................................................................17

3.1.1 Read ......................................................................................................................17

3.1.2 Write ......................................................................................................................17

3.1.3 Output Disable .......................................................................................................17

3.1.4 Standby..................................................................................................................18

3.1.5 Reset .....................................................................................................................18

Read Mode .........................................................................................................................19

4.1.1 Read Array.............................................................................................................19

4.1.2 Read Identifier .......................................................................................................19

4.1.3 CFI Query ..............................................................................................................20

4.1.4 Read Status Register.............................................................................................20

4.1.4.1 Clear Status Register .............................................................................21

Program Mode ....................................................................................................................21

4.2.1 12-Volt Production Programming...........................................................................21

4.2.2 Suspending and Resuming Program .....................................................................22

Erase Mode ........................................................................................................................22

4.3.1 Suspending and Resuming Erase .........................................................................23

Flexible Block Locking ........................................................................................................27

5.1.1 Locking Operation..................................................................................................28

5.1.1.1 Locked State ..........................................................................................28

5.1.1.2 Unlocked State.......................................................................................28

5.1.1.3 Lock-Down State....................................................................................28

Reading Block-Lock Status.................................................................................................28

Locking Operations during Erase Suspend ........................................................................29

Status Register Error Checking ..........................................................................................29

128-Bit Protection Register .................................................................................................29

5.5.1 Reading the Protection Register ............................................................................30

5.5.2 Programming the Protection Register....................................................................30

5.5.3 Locking the Protection Register .............................................................................30

Program and Erase Voltages ......................................................................................30

Device Description

........................................................................................................................8

Device Operations

.......................................................................................................................17

4.0

Modes of Operation

.....................................................................................................................19

4.1

4.2

4.3

5.0

Security Modes

............................................................................................................................27

5.1

5.2

5.3

5.4

5.5

5.6

Datasheet

Contents

5.6.1

6.0

Program Protection................................................................................................ 31

Power Consumption....................................................................................................................

6.1

6.2

6.3

6.4

6.5

Active Power (Program/Erase/Read).................................................................................. 32

Automatic Power Savings (APS) ........................................................................................ 32

Standby Power ................................................................................................................... 32

Deep Power-Down Mode.................................................................................................... 32

Power and Reset Considerations ....................................................................................... 33

6.5.1 Power-Up/Down Characteristics............................................................................ 33

6.5.2 RP# Connected to System Reset .......................................................................... 33

6.5.3 VCC, VPP and RP# Transitions ............................................................................ 33

Power Supply Decoupling................................................................................................... 34

Absolute Maximum Ratings ................................................................................................ 34

Operating Conditions .......................................................................................................... 35

DC Current Characteristics................................................................................................. 35

DC Voltage Characteristics................................................................................................. 38

AC Read Characteristics .................................................................................................... 39

AC Write Characteristics..................................................................................................... 43

Erase and Program Timings ............................................................................................... 47

Reset Specifications ........................................................................................................... 48

AC I/O Test Conditions ....................................................................................................... 49

Device Capacitance............................................................................................................ 49

6.6

7.0

7.1

7.2

7.3

7.4

8.0

8.1

8.2

8.3

8.4

8.5

8.6

Thermal and DC Characteristics

................................................................................................ 34

AC Characteristics

...................................................................................................................... 39

Appendix A Write State Machine States.............................................................................................50

Appendix B Flow Charts

......................................................................................................................52

Appendix C Common Flash Interface.................................................................................................58

Appendix D Mechanical Specifications..............................................................................................64

Appendix E Additional Information

....................................................................................................67

Appendix F Ordering Information

.......................................................................................................68

Datasheet

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