82HS641B/BJA datasheet, PDF - EEWORLD Datasheet

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82HS641B/BJA: DescriptionIC 8K X 8 OTPROM, 45 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM; Categorystorage storage; File Size80KB，4 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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82HS641B/BJA Overview

IC 8K X 8 OTPROM, 45 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM

82HS641B/BJA Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	45 ns
JESD-30 code	R-GDIP-T24
memory density	65536 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.715 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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82HS641B/BJA Related Products

	82HS641B/BJA	82HS641A/B3A	82HS641A/BJA	5962-8200902JA	82HS641B/B3A
Description	IC 8K X 8 OTPROM, 45 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM	IC 8K X 8 OTPROM, 55 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM	IC 8K X 8 OTPROM, 55 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM	IC 8K X 8 OTPROM, 55 ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24, Programmable ROM	IC 8K X 8 OTPROM, 45 ns, CQCC28, CERAMIC, LLCC-28, Programmable ROM
Maker	NXP	NXP	NXP	NXP	NXP
Parts packaging code	DIP	QLCC	DIP	DIP	QLCC
package instruction	DIP,	QCCN,	DIP,	DIP,	QCCN,
Contacts	24	28	24	24	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	45 ns	55 ns	55 ns	55 ns	45 ns
JESD-30 code	R-GDIP-T24	S-CQCC-N28	R-GDIP-T24	R-GDIP-T24	S-CQCC-N28
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	24	28	24	24	28
word count	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	QCCN	DIP	DIP	QCCN
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	1.905 mm	5.715 mm	5.715 mm	1.905 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	QUAD
width	15.24 mm	11.43 mm	15.24 mm	15.24 mm	11.43 mm
Base Number Matches	1	1	1	1	1

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