OTP ROM, 1KX8, TTL, PQCC28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 28 |
| word count | 1024 words |
| character code | 1000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| Maximum slew rate | 0.175 mA |
| surface mount | YES |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| 82HS187AD | N82HS187N-B | 82HS187D | 82HS187A/BLA | N82HS187AN-B | N82HS187N | N82HS187AN | N82HS187AF | N82HS187F | |
|---|---|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 1KX8, TTL, PQCC28 | OTP ROM, 1KX8, TTL, PDIP24 | OTP ROM, 1KX8, TTL, PQCC28 | OTP ROM, 1KX8, TTL, CDIP24 | OTP ROM, 1KX8, TTL, PDIP24 | OTP ROM, 1KX8, TTL, PDIP24 | OTP ROM, 1KX8, TTL, PDIP24 | OTP ROM, 1KX8, TTL, CDIP24 | OTP ROM, 1KX8, TTL, CDIP24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 28 | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | QCCJ | DIP | QCCJ | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | LDCC28,.5SQ | DIP24,.3 | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| surface mount | YES | NO | YES | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | - |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 0.175 mA | - | 0.175 mA | - | - | 0.175 mA | 0.175 mA | 0.175 mA | 0.175 mA |