AM49PDL127BH66FS datasheet, PDF

Datasheet> All Categories > storage> storage> AM49PDL127BH66FS

AM49PDL127BH66FS: DescriptionMemory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73; Categorystorage storage; File Size1MB，86 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

Download Datasheet Parametric Compare View All

AM49PDL127BH66FS Overview

Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73

AM49PDL127BH66FS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	73
Reach Compliance Code	compliant
Other features	PSEUDO SRAM IS ORGANIZED AS 2M X 16
JESD-30 code	R-PBGA-B73
JESD-609 code	e1
length	11.6 mm
memory density	134217728 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	73
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	8 mm
Base Number Matches	1

Preview

Download Datasheet

View All

Am49PDL127BH/

Am49PDL129BH

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

30452

Revision

Amendment

Issue Date

December 16, 2003

AM49PDL127BH66FS Related Products

	AM49PDL127BH66FS	AM49PDL129BH66FT	AM49PDL129BH85FS	AM49PDL127BH85FS	AM49PDL127BH85FT	AM49PDL127BH66FT	AM49PDL129BH85FT
Description	Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73	Memory Circuit, 8MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,
Contacts	73	73	73	73	73	73	73
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compli
Other features	PSEUDO SRAM IS ORGANIZED AS 2M X 16	PSEUDO SRAM IS ORGANIZED AS 2M X 16	PSEUDO SRAM IS ORGANIZED AS 2M X 16	PSEUDO SRAM IS ORGANIZED AS 2M X 16	PSEUDO SRAM IS ORGANIZED AS 2M X 16	PSEUDO SRAM IS ORGANIZED AS 2M X 16	PSEUDO SRAM IS ORGANIZED AS 2M X 16
JESD-30 code	R-PBGA-B73	R-PBGA-B73	R-PBGA-B73	R-PBGA-B73	R-PBGA-B73	R-PBGA-B73	R-PBGA-B73
JESD-609 code	e1	e1	e1	e1	e1	e1	e1
length	11.6 mm	11.6 mm	11.6 mm	11.6 mm	11.6 mm	11.6 mm	11.6 mm
memory density	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bi
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16	16	16	16	16
Humidity sensitivity level	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1
Number of terminals	73	73	73	73	73	73	73
word count	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words
character code	8000000	8000000	8000000	8000000	8000000	8000000	8000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16	8MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40	40	40	40
width	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm
Maker	SPANSION	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION
Base Number Matches	1	1	1	1	1	1	-

Recommended Resources

Agricultural temperature control circuit

Circuit structure and equivalent circuit of downconverter a

Variable frequency low frequency LC oscillator circuit

Coded anti-theft alarm circuit

lMHz oscillator using a TTL gate

Computer motherboard circuit diagram 440BX_13

BlueSign AB32VG1 RISC-V Development Board DIY Project Challenge: BlueSign AB32VG1 RISC-V Development Board DIY Project Challenge...; 火辣西米秀 Domestic Chip Exchange

There is a 2G module with 1800M exceeding the standard by 1DB. Has anyone encountered this? Please share your experience.: There is a 2G module with 1800M exceeding the standard by 1DB. Has anyone encountered this? Please share your experience....; QWE4562009 Test/Measurement

The program stops at the disassembled code: [color=rgb(68, 68, 68)][font=Tahoma,]I use STM8S207C8T6 to write a program, and use the development environment IAR. [/font][/color] [color=rgb(68, 68, 68)][font=Tahoma,]I set a breakpoint in the prog...; chenbingjy stm32/stm8

DC-DC Applications: I would like to ask if the FB pin of the DC-DC BUCK chip can be directly connected to the ground through a resistor to output all the inputs?...; 阿卡时间段 Power technology

【MP430 Sharing】MSP430 Carbon Monoxide Alarm: I have a special feeling for alarms, so I pay special attention to this. MSP430 is famous for its power saving, and with the carbon monoxide sensor, it should be very power saving. I think it is not i...; ddllxxrr Microcontroller MCU

[Video Sharing] Power Design Tips 50: How to Avoid Common Defects of Aluminum Electrolytic Capacitors: What do you think after reading Power Design Tip 49? Now I will continue to share with you Power Design Tip 50: How to avoid common defects of aluminum electrolytic capacitors. Aluminum electrolytic c...; 德州仪器_视频 Analogue and Mixed Signal

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components