EEWORLDEEWORLDEEWORLD

Part Number

Search

N74LV139N

Description
IC LV/LV-A/LVX/H SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16, Decoder/Driver
Categorylogic    logic   
File Size206KB,12 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

N74LV139N Overview

IC LV/LV-A/LVX/H SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16, Decoder/Driver

N74LV139N Parametric

Parameter NameAttribute value
MakerNXP
package instructionDIP,
Reach Compliance Codeunknown
ECCN codeEAR99
seriesLV/LV-A/LVX/H
JESD-30 codeR-PDIP-T16
Load capacitance (CL)50 pF
Logic integrated circuit typeOTHER DECODER/DRIVER
Number of functions2
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output polarityINVERTED
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
propagation delay (tpd)23 ns
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Base Number Matches1

N74LV139N Related Products

N74LV139N N74LV139PWDH-T N74LV139PWDH
Description IC LV/LV-A/LVX/H SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16, Decoder/Driver IC LV/LV-A/LVX/H SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16, Decoder/Driver IC LV/LV-A/LVX/H SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDSO16, Decoder/Driver
Maker NXP NXP NXP
package instruction DIP, TSSOP, TSSOP,
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
series LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 code R-PDIP-T16 R-PDSO-G16 R-PDSO-G16
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type OTHER DECODER/DRIVER OTHER DECODER/DRIVER OTHER DECODER/DRIVER
Number of functions 2 2 2
Number of terminals 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Output polarity INVERTED INVERTED INVERTED
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 23 ns 23 ns 23 ns
Certification status Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1 V 1 V 1 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount NO YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form THROUGH-HOLE GULL WING GULL WING
Terminal location DUAL DUAL DUAL
Base Number Matches 1 1 1
length - 5 mm 5 mm
Maximum seat height - 1.1 mm 1.1 mm
Terminal pitch - 0.65 mm 0.65 mm
width - 4.4 mm 4.4 mm

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1809  892  2012  840  2325  37  18  41  17  47 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号