EEWORLDEEWORLDEEWORLD

Part Number

Search

HYM532810CM-50

Description
Fast Page DRAM Module, 8MX32, 50ns, CMOS, PSMA72, SIMM-72
Categorystorage    storage   
File Size324KB,10 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric Compare View All

HYM532810CM-50 Overview

Fast Page DRAM Module, 8MX32, 50ns, CMOS, PSMA72, SIMM-72

HYM532810CM-50 Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeSIMM
package instructionSIMM, SSIM72
Contacts72
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFAST PAGE
Maximum access time50 ns
Other featuresCAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH
I/O typeCOMMON
JESD-30 codeR-PSMA-N72
memory density268435456 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width32
Number of functions1
Number of ports1
Number of terminals72
word count8388608 words
character code8000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle2048
Maximum seat height25.4 mm
self refreshNO
Maximum standby current0.016 A
Maximum slew rate1.18 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE
Base Number Matches1

HYM532810CM-50 Related Products

HYM532810CM-50 HYM532810CM-60 HYM532810CM-70 HYM532810CMG-50 HYM532810CMG-60 HYM532810CMG-70
Description Fast Page DRAM Module, 8MX32, 50ns, CMOS, PSMA72, SIMM-72 Fast Page DRAM Module, 8MX32, 60ns, CMOS, PSMA72, SIMM-72 Fast Page DRAM Module, 8MX32, 70ns, CMOS, PSMA72, SIMM-72 Fast Page DRAM Module, 8MX32, 50ns, CMOS, PSMA72, SIMM-72 Fast Page DRAM Module, 8MX32, 60ns, CMOS, PSMA72, SIMM-72 Fast Page DRAM Module, 8MX32, 70ns, CMOS, PSMA72, SIMM-72
Maker SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
Parts packaging code SIMM SIMM SIMM SIMM SIMM SIMM
package instruction SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72
Contacts 72 72 72 72 72 72
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
Maximum access time 50 ns 60 ns 70 ns 50 ns 60 ns 70 ns
Other features CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH CAS BEFORE RAS/RAS ONLY/HIDDEN/ SELF REFRESH
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72
memory density 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 72 72 72 72 72 72
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 8MX32 8MX32 8MX32 8MX32 8MX32 8MX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SIMM SIMM SIMM SIMM SIMM SIMM
Encapsulate equivalent code SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 2048 2048 2048 2048 2048 2048
Maximum seat height 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.4 mm
self refresh NO NO NO NO NO NO
Maximum standby current 0.016 A 0.016 A 0.016 A 0.016 A 0.016 A 0.016 A
Maximum slew rate 1.18 mA 0.98 mA 0.82 mA 1.18 mA 0.98 mA 0.82 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Base Number Matches 1 1 - - 1 1
How to dial up to the Internet via a Bluetooth phone
I want to realize that Wince device connects to Bluetooth mobile phone through Bluetooth module to dial up Internet. Currently, a colleague has realized the function of connecting the device to Blueto...
xgl_1982 Embedded System
I added the library file DriverLib but there is still an error. Please help! ! Urgent solution!
Compilation error of code based on lm3s6911 chip written by keil: cannot open lm3s6911f10x.h. I have also added the library file DriverLib.lib, but there are still errors that need to be solved. Pleas...
zhaomonuo MCU
EETALK - What would you do with the Raspberry Pi 2nd Generation that supports Windows 10?
[font=微软雅黑][size=3] "The cheapest computer in the world" -- Raspberry Pi (element14, RS Components) announced the sale of the second generation version. The price is the same as the previous generatio...
eric_wang Mobile and portable
Discussion: The demand and management of PLM system in EDA design field
【 Introduction 】   Product Lifecycle Management (PLM) is a broad concept that includes product information management, where product information includes all processes from initial market definition, ...
fighting FPGA/CPLD
Electric baking pan has arrived, thanks to Renesas
I wrote my home address directly. My dad informed me that the goods had arrived the day before yesterday. I feel so happy. I can now grill meat and make pancakes~:)...
sinde Renesas Electronics MCUs
There are many ways for computers to leak information. Analyzing CPU noise can crack encrypted information
A study conducted by the Weizmann Institute in Israel has initially confirmed that it is possible to decrypt encrypted information by analyzing the noise emitted by computer chips. The researchers rec...
zzzzer16 MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 723  1209  508  683  432  15  25  11  14  9 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号