3829416BZC datasheet, PDF - EEWORLD Datasheet

3829416BZC: DescriptionStandard SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28; Categorystorage storage; File Size197KB，8 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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3829416BZC Overview

Standard SRAM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28

Parameter Name	Attribute value
Maker	Micross
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	20 ns
JESD-30 code	R-CDIP-T28
JESD-609 code	e4
length	35.56 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.06 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	PALLADIUM GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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