IC,OP-AMP,DUAL,BIPOLAR/JFET,DIP,8PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Maximum bias current (IIB) at 25C | 0.0002 µA |
| frequency compensation | YES |
| Maximum input offset current (IIO) | 0.004 µA |
| Maximum input offset voltage | 13000 µV |
| JESD-30 code | R-XDIP-T8 |
| JESD-609 code | e0 |
| low-bias | YES |
| low-dissonance | NO |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| LF353J-8 | LF353J | LF353N | LF353AN | LF353BN | LF353H | |
|---|---|---|---|---|---|---|
| Description | IC,OP-AMP,DUAL,BIPOLAR/JFET,DIP,8PIN,CERAMIC | IC,OP-AMP,DUAL,BIPOLAR/JFET,DIP,8PIN,CERAMIC | LF353N | IC,OP-AMP,DUAL,BIPOLAR/JFET,DIP,8PIN,PLASTIC | LF353BN | IC,OP-AMP,DUAL,BIPOLAR/JFET,CAN,8PIN,METAL |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | , CAN8,.2 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Maximum bias current (IIB) at 25C | 0.0002 µA | 0.0002 µA | 0.0002 µA | 0.0002 µA | 0.0002 µA | 0.0002 µA |
| frequency compensation | YES | YES | YES | YES | YES | YES |
| Maximum input offset current (IIO) | 0.004 µA | 0.004 µA | 0.004 µA | 0.002 µA | 0.004 µA | 0.004 µA |
| Maximum input offset voltage | 13000 µV | 13000 µV | 13000 µV | 4000 µV | 7000 µV | 13000 µV |
| JESD-30 code | R-XDIP-T8 | R-XDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | O-MBCY-W8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| low-bias | YES | YES | YES | YES | YES | YES |
| low-dissonance | NO | NO | NO | NO | NO | NO |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | METAL |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | CAN8,.2 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CYLINDRICAL |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | WIRE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM |
| Parts packaging code | DIP | DIP | - | DIP | DIP | BCY |
| Contacts | 8 | 8 | - | 8 | 8 | 8 |
| ECCN code | EAR99 | EAR99 | - | EAR99 | - | EAR99 |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | - |
| surface mount | NO | NO | NO | NO | NO | - |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |