NT
SinglFuse
™
SF-0402S Series Features
■
Single blow fuse for overcurrent
■
Thin film chip fuse
■
Surface mount packaging for automated
M
PL
IA
protection
■
1005 (EIA 0402) miniature footprint
■
Slow blow fuse
■
UL certified
■
RoHS compliant* and
halogen free
S
CO
*R
assembly
oH
SF-0402S Series - Slow Blow Surface Mount Fuses
Electrical Characteristics
Model
SF-0402S050
SF-0402S080
SF-0402S100
SF-0402S125
SF-0402S150
SF-0402S160
SF-0402S200
SF-0402S250
SF-0402S300
SF-0402S315
SF-0402S400
Rated Current
(Amps)
0.50
0.80
1.00
1.25
1.50
1.60
2.00
2.50
3.00
3.15
4.00
Fusing Time
Open within 5
sec. at 250 %
rated current
Resistance
(mΩ) Typ.*
235
86
64
45
35
32
24
19
15
14
10.5
Rated
Voltage
Breaking
Capacity
DC 24 V
DC24 V 35 A
Typical
I
2
t (A
2
s)
0.00370
0.00947
0.01479
0.02310
0.02400
0.03734
0.04040
0.06760
0.09860
0.10868
0.11450
*Resistance value was measured with less than 10 % of rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity ..................................... No fusing....................................................Rated current, 4 hours
Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current
Interrupting Ability .................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat........................ ±20 % ........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 % ........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent............................... No evident damage on protective .............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance ................................. 10k W or more ...........................................Measure DC resistance after fusing
Thermal Shock ......................................... DR < 10 % .................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SF - 0402 S 050 - 2
SinglFuse™
Product Designator
SMD Footprint
1005 (EIA 0402) size
RATING CURRENT (A)
F = 0.50
S = 2.00
K = 0.80
T = 2.50
L = 1.00
3 = 3.00
M = 1.25
U = 3.15
P = 1.50
W = 4.00
N = 1.60
Fuse Blow Type
F = Fast acting
S = Slow blow
Rated Current
050-400 (500 mA - 4.00 A)
Packaging Type
- 2 = Tape & Reel (10,000 pcs./reel)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
SinglFuse
™
SF-0402S Series Applications
■
Portable memory
■
LCD monitors
■
Disk drives
■
PDAs
■
Digital cameras
■
DVDs
■
Cell phones
■
Rechargeable battery packs
■
Battery chargers
■
Set top boxes
■
Industrial controllers
SF-0402S Series - Slow Blow Surface Mount Fuses
Solder Reflow Recommendations
250
Peak: 250 +0/-5 °C
230 °C or higher
TEMPERATURE (°C)
200
180 °C
150
150 °C
PRE-HEATING ZONE
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
90 ± 30 Seconds
100
30 ± 10 Seconds
SOLDERING ZONE
50
HEATING TIME
Product Dimensions
1.0 ± 0.1
(.039 ± .004)
0.35 ± 0.05
(.014 ± .002)
0.52 ± 0.05
(.020 ± .002)
0.25 ± 0.1
(.010 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.2 ± 0.1
(.008 ± .004)
0.25 ± 0.1
(.010 ± .004)
Recommended Pad Layout
0.381
(.015)
0.558
(.022)
DIMENSIONS:
PACKAGING: 10,000 pcs./reel
MM
(INCHES)
1.55
(.061)
Thermal Derating Curve
120
Construction & Material Content
OVERCOAT
PERCENT OF RATING (%)
110
100
Sn PLATING
FUSE ELEMENT
Cu / Ni PLATING
90
CERAMIC SUBSTRATE
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
Microcontroller MCU
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