MC68HC08GR32ACFJ datasheet, PDF

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MC68HC08GR32ACFJ: Description8-BIT, MROM, 8 MHz, MICROCONTROLLER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，286 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC68HC08GR32ACFJ Overview

8-BIT, MROM, 8 MHz, MICROCONTROLLER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32

MC68HC08GR32ACFJ Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	QFP
package instruction	7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
Contacts	32
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Has ADC	YES
Other features	ALSO OPERATES AT 3.3V SUPPLY @ 4MHZ
Address bus width
bit size	8
CPU series	68HC08
maximum clock frequency	32 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PQFP-G32
length	7 mm
Humidity sensitivity level	1
Number of I/O lines	21
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP32,.35SQ,32
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Peak Reflow Temperature (Celsius)	225
power supply	3.3/5 V
Certification status	Not Qualified
RAM (bytes)	1536
rom(word)	32256
ROM programmability	MROM
Maximum seat height	1.6 mm
speed	8 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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MC68HC08GR32A

MC68HC08GR16A

Data Sheet

M68HC08

Microcontrollers

MC68HC08GR32A

Rev. 0

04/2006

freescale.com

List of Chapters

Chapter 1 General Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Chapter 2 Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Chapter 3 Analog-to-Digital Converter (ADC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

Chapter 4 Clock Generator Module (CGM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

Chapter 5 Mask Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Chapter 6 Computer Operating Properly (COP) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Chapter 7 Central Processor Unit (CPU). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Chapter 8 External Interrupt (IRQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Chapter 9 Keyboard Interrupt Module (KBI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Chapter 10 Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Chapter 11 Low-Voltage Inhibit (LVI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Chapter 12 Input/Output (I/O) Ports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

Chapter 13 Enhanced Serial Communications Interface (ESCI) Module . . . . . . . . . . . . . 133

Chapter 14 System Integration Module (SIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

Chapter 15 Serial Peripheral Interface (SPI) Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183

Chapter 16 Timebase Module (TBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203

Chapter 17 Timer Interface Module (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207

Chapter 18 Timer Interface Module (TIM2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .223

Chapter 19 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243

Chapter 20 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259

Chapter 21 Ordering Information and Mechanical Specifications . . . . . . . . . . . . . . . . . . 275

MC68HC08GR32A • MC68HC08GR16A Data Sheet, Rev. 0

Freescale Semiconductor

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