|
74AHC08BQ-Q100 |
74AHC08D-Q100 |
74AHCT08BQ-Q100 |
74AHC08PW-Q100 |
74AHCT08D-Q100 |
74AHCT08PW-Q100 |
| Description |
AHC/VHC/H/U/V SERIES, QUAD 2-INPUT AND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 |
AHC/VHC/H/U/V SERIES, QUAD 2-INPUT AND GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 |
AHC/VHC/H/U/V SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 |
AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
AHCT/VHCT/VT SERIES, QUAD 2-INPUT AND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Maker |
NXP |
NXP |
NXP |
NXP |
NXP |
NXP |
| Parts packaging code |
QFN |
SOIC |
QFN |
TSSOP |
SOIC |
TSSOP |
| package instruction |
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 |
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14 |
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 |
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 |
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 |
| Contacts |
14 |
14 |
14 |
14 |
14 |
14 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknow |
| series |
AHC/VHC/H/U/V |
AHC/VHC/H/U/V |
AHCT/VHCT/VT |
AHC/VHC/H/U/V |
AHCT/VHCT/VT |
AHCT/VHCT/VT |
| JESD-30 code |
R-PQCC-N14 |
R-PDSO-G14 |
R-PQCC-N14 |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
| length |
3 mm |
8.65 mm |
3 mm |
5 mm |
8.65 mm |
5 mm |
| Logic integrated circuit type |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
AND GATE |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of functions |
4 |
4 |
4 |
4 |
4 |
4 |
| Number of entries |
2 |
2 |
2 |
2 |
2 |
2 |
| Number of terminals |
14 |
14 |
14 |
14 |
14 |
14 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HVQCCN |
SOP |
HVQCCN |
TSSOP |
SOP |
TSSOP |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
260 |
260 |
| propagation delay (tpd) |
15.5 ns |
15.5 ns |
10 ns |
15.5 ns |
10 ns |
10 ns |
| Filter level |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
| Maximum seat height |
1 mm |
1.75 mm |
1 mm |
1.1 mm |
1.75 mm |
1.1 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
2 V |
2 V |
4.5 V |
2 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
| Terminal form |
NO LEAD |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
1.27 mm |
0.5 mm |
0.65 mm |
1.27 mm |
0.65 mm |
| Terminal location |
QUAD |
DUAL |
QUAD |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
30 |
30 |
30 |
30 |
30 |
30 |
| width |
2.5 mm |
3.9 mm |
2.5 mm |
4.4 mm |
3.9 mm |
4.4 mm |