AND Gate, HC/UH Series, 3-Func, 3-Input, CMOS, PDIP14, PLASTIC, DIP-14
| Parameter Name | Attribute value |
| Maker | AVG [AVG Semiconductors(HITEK)] |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | HC/UH |
| JESD-30 code | R-PDIP-T14 |
| length | 18.86 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | AND GATE |
| Number of functions | 3 |
| Number of entries | 3 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| propagation delay (tpd) | 190 ns |
| Certification status | Not Qualified |
| Maximum seat height | 4.69 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 4.5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| DV74HC11N | DV74HC11D | |
|---|---|---|
| Description | AND Gate, HC/UH Series, 3-Func, 3-Input, CMOS, PDIP14, PLASTIC, DIP-14 | AND Gate, HC/UH Series, 3-Func, 3-Input, CMOS, PDSO14, PLASTIC, SOP-14 |
| Maker | AVG [AVG Semiconductors(HITEK)] | AVG [AVG Semiconductors(HITEK)] |
| Parts packaging code | DIP | SOIC |
| package instruction | DIP, | PLASTIC, SOP-14 |
| Contacts | 14 | 14 |
| Reach Compliance Code | unknown | unknown |
| series | HC/UH | HC/UH |
| JESD-30 code | R-PDIP-T14 | R-PDSO-G14 |
| length | 18.86 mm | 8.65 mm |
| Load capacitance (CL) | 50 pF | 50 pF |
| Logic integrated circuit type | AND GATE | AND GATE |
| Number of functions | 3 | 3 |
| Number of entries | 3 | 3 |
| Number of terminals | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| propagation delay (tpd) | 190 ns | 190 ns |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 4.69 mm | 1.75 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 4.5 V | 4.5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| width | 7.62 mm | 3.9 mm |