MSAS-168-ZE-GT-17 datasheet, PDF

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MSAS-168-ZE-GT-17: DescriptionPGA168, IC SOCKET, ROHS COMPLIANT; CategoryThe connector socket; File Size633KB，2 Pages; ManufacturerSAMTEC; Websitehttp://www.samtec.com/; Environmental Compliance

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MSAS-168-ZE-GT-17 Overview

PGA168, IC SOCKET, ROHS COMPLIANT

MSAS-168-ZE-GT-17 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMTEC
package instruction	ROHS COMPLIANT
Reach Compliance Code	compliant
Factory Lead Time	2 weeks
Other features	ULTRA LOW INSERTION FORCE
Contact to complete cooperation	GOLD (30) OVER NICKEL
Contact completed and terminated	TIN OVER NICKEL; TIN OVER COPPER
Contact material	BERYLLIUM COPPER
Device slot type	IC SOCKET
Type of equipment used	PGA168
Shell material	LIQUID CRYSTAL POLYMER
JESD-609 code	e3
Manufacturer's serial number	MSAS
Number of contacts	168

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F-210 SUPPLEMENT

(2,54mm) .100"

MPAS, MVAS, MSAS SERIES

MPAS–068–ZSGT–11

MPAS–144–ZSGT–13

PIN GRID ARRAY SOCKETS

Mates with:

MPAT, MVAT, MHAT, MSAT

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MPAS

or www.samtec.com?MVAS

BODY

STYLE

COUNT

LEAD

STYLE

PLATING

OPTION

PIN OUT

CODE

OPTION

MPAS

= Standard

Polyester

MVAS

= Open

Body Polyester

–“XXX”

= Total Number

of Filled

Positions

= 30µ" (0,76µm)

Gold Contact,

10µ" (0,25µm)

Gold Shell

–2

= (9,14).360

Wire-Wrap

(–ZW Only)

MPAS, MVAS

Insulator Material:

Black G.F. Polyester

Contact:

BeCu

Shell:

Brass except Style K

Phospher Bronze

Operating Temp Range:

-55°C to +105°C with Tin

-55°C to +125°C with Gold

Plating:

Au over 50µ"(1,27µm) Ni or

Sn over 100µ" (2,58µm) Cu or

50µ" (1,27µm) Ni

Current Rating:

Contact Resistance:

10mΩ max

Lead Size Range:

.015" (0,38mm) to

.022" (0,56mm) DIA

Insertion Force:

(Single contact only)

Style ZU = 1.5oz (0,42N) max,

all others = 2.5 oz (0,69N) avg,

5.5 oz (1,53N) max

Withdrawal Force:

(Single contact only)

Style ZU = 1.5oz (0,42N) max,

all others = 2.0 oz (0,56N) avg,

0.35 oz (0,97N) min

Lead-Free Solderable:

Wave, only

RoHS Compliant:

MSAS

= Hi-Temp LCP

Open Body

No. of Positions X .100 (2,54) SQ

ALSO AVAILABLE

= 30µ" (0,76µm)

Gold Contact,

Tin Shell

–3

= (6,60).260

Wire-Wrap

(–ZW Only)

(2,54)

.100

RoHS compliant

options.

Call Samtec.

–L

= Locking

Socket

(–ZS Only)

fre

w.sam

tec.com/lead-

= Tin Contact

and Shell

(Styles –ZS &

ZW Only)

= 10µ" (5,08µm)

Gold Contact,

Tin Shell

(Style –ZS only)

(7,62)

.300

(3,43)

.135

Requires GT

Plating Option

–ZW

= Wire Wrap

Shorter w/w

tail lengths

available.

See OPTION.

(4,90)

.193

(1,32)

.052

DIA

(0,76)

.030

–ZE

= Elevated

(0,76)

.030

(1,32)

.052

DIA

(13,77)

.542

(0,89)

.035

DIA

(0,51)

.020

DIA

Insertion Depth = .125" to .170"

Style ZE Component Part No. = EZ-2P3

(4,32)

.170

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

(12,95)

.510

(8,86)

.348

SPECIFICATIONS

For complete speciﬁcations

see www.samtec.com?MSAS

MSAS

Insertion Depth = .125" to .157"

Style ZW Component Part No. = EZ-1W1(1)

Style ZW-2 Component Part No. = EZ-1W1(2)

Style ZW-3 Component Part No. = EZ-1W1(3)

(0,64)

.025

Same as

MPAS except:

Insulator Material:

Black Liquid Crystal Polymer

Max Processing Temp:

230°C for 30 to 60 seconds

–ZS, –ZU, –ZA

= Printed Circuit

(0,76)

.030

LEAD

STYLE

DIA

(0,51)

.020

(0,51)

.020

TAIL

(3,18)

.125

(4,57)

.180

OAL

(7,62)

.300

(8,89)

.350

(1,32)

.052

DIA

Insertion Depth = .095" to .145",

Style ZS Component Part No. = EZ-1P1

Style ZA Component Part No. = EZ-6P1

Option L Component Part No. = SC-1L1 or EZ-1L1

–ZS, –ZU

–ZA

Note:

Some sizes, styles and

options are non-standard,

non-returnable.

Locking lead (–L) available.

See OPTION.

WWW.SAMTEC.COM

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