†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2
BC817−16LT1, BC817−25LT1, BC817−40LT1
1000
V
CE
= 1 V
T
J
= 25°C
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
1.0
T
J
= 25°C
0.8
hFE, DC CURRENT GAIN
0.6
I
C
= 10 mA
100 mA
300 mA
500 mA
100
0.4
0.2
0
0.01
10
0.1
1.0
10
100
I
C
, COLLECTOR CURRENT (mA)
1000
0.1
1
I
B
, BASE CURRENT (mA)
10
100
Figure 1. DC Current Gain
Figure 2. Saturation Region
θ
V, TEMPERATURE COEFFICIENTS (mV/
°
C)
1.0
T
A
= 25°C
0.8
V, VOLTAGE (VOLTS)
V
BE(on)
@ V
CE
= 1 V
0.6
V
BE(sat)
@ I
C
/I
B
= 10
+1
q
VC
for V
CE(sat)
0
0.4
-1
0.2
V
CE(sat)
@ I
C
/I
B
= 10
0
1
10
100
I
C
, COLLECTOR CURRENT (mA)
1000
-2
q
VB
for V
BE
1
10
100
I
C
, COLLECTOR CURRENT (mA)
1000
Figure 3. “On” Voltages
Figure 4. Temperature Coefficients
100
1
1s
100 ms
1 ms
10 ms
C, CAPACITANCE (pF)
Thermal Limit
0.1
C
ib
10
I
C
(A)
C
ob
0.01
Single Pulse Test @ T
A
= 25°C
1
0.1
0.001
1
10
V
R
, REVERSE VOLTAGE (VOLTS)
100
0.01
0.1
1
V
CE
(Vdc)
10
100
Figure 5. Capacitances
Figure 6. BC817−40L Safe Operating Area
http://onsemi.com
3
BC817−16LT1, BC817−25LT1, BC817−40LT1
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
SEE VIEW C
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU
−07
AND
−09
OBSOLETE, NEW
STANDARD 318−08.
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
E
1
2
HE
e
b
q
0.25
A
A1
L
L1
VIEW C
DIM
A
A1
b
c
D
E
e
L
L1
H
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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