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LMP7702MM/NOPB

Description
IC DUAL OP-AMP, 5200 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, PDSO8, ROHS COMPLAINT, MOSP-8, Operational Amplifier
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size1MB,24 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Environmental Compliance
Stay tuned Parametric Compare

LMP7702MM/NOPB Overview

IC DUAL OP-AMP, 5200 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, PDSO8, ROHS COMPLAINT, MOSP-8, Operational Amplifier

LMP7702MM/NOPB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNational Semiconductor(TI )
Parts packaging codeSOIC
package instructionTSSOP, TSSOP8,.19
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)0.0004 µA
Maximum bias current (IIB) at 25C0.000001 µA
Nominal Common Mode Rejection Ratio138 dB
frequency compensationYES
Maximum input offset voltage5200 µV
JESD-30 codeS-PDSO-G8
JESD-609 codee3
length3 mm
low-biasYES
low-dissonanceYES
Humidity sensitivity level1
Negative supply voltage upper limit-6.6 V
Nominal Negative Supply Voltage (Vsup)-5 V
Number of functions2
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3/5/+-5 V
Certification statusNot Qualified
Maximum seat height1.09 mm
Nominal slew rate1.1 V/us
Maximum slew rate2.5 mA
Supply voltage upper limit6.6 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
Nominal Uniform Gain Bandwidth2500 kHz
Minimum voltage gain50100
width3 mm

LMP7702MM/NOPB Related Products

LMP7702MM/NOPB LMP7702MA/NOPB LMP7702MAX/NOPB LMP7702MA LMP7702MAX
Description IC DUAL OP-AMP, 5200 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, PDSO8, ROHS COMPLAINT, MOSP-8, Operational Amplifier IC DUAL OP-AMP, 2.5 MHz BAND WIDTH, PDSO8, LEAD FREE, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 520 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 520 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier IC DUAL OP-AMP, 520 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier
Is it Rohs certified? conform to conform to conform to incompatible incompatible
Maker National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI ) National Semiconductor(TI )
Parts packaging code SOIC SOIC SOIC SOIC SOIC
package instruction TSSOP, TSSOP8,.19 SOP, SOP8,.25 SOP, SOP8,.25 SOIC-8 SOIC-8
Contacts 8 8 8 8 8
Reach Compliance Code compliant compliant compliant _compli _compli
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Maximum bias current (IIB) at 25C 0.000001 µA 0.000001 µA 0.000001 µA 0.000001 µA 0.000001 µA
Nominal Common Mode Rejection Ratio 138 dB 138 dB 138 dB 138 dB 138 dB
frequency compensation YES YES YES YES YES
Maximum input offset voltage 5200 µV 520 µV 520 µV 520 µV 520 µV
JESD-30 code S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e3 e3 e0 e0
length 3 mm 4.902 mm 4.9 mm 4.9 mm 4.9 mm
low-bias YES YES YES YES YES
low-dissonance YES YES YES YES YES
Humidity sensitivity level 1 1 1 1 1
Negative supply voltage upper limit -6.6 V -6.6 V -6.6 V -6.6 V -6.6 V
Nominal Negative Supply Voltage (Vsup) -5 V -5 V -5 V -5 V -5 V
Number of functions 2 2 2 2 2
Number of terminals 8 8 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP SOP SOP SOP
Encapsulate equivalent code TSSOP8,.19 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
method of packing TAPE AND REEL RAIL TAPE AND REEL RAIL TAPE AND REEL
power supply 3/5/+-5 V +-1.35/+-6/2.7/12 V +-1.35/+-6/2.7/12 V +-1.35/+-6/2.7/12 V +-1.35/+-6/2.7/12 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.09 mm 1.753 mm 1.753 mm 1.753 mm 1.753 mm
Maximum slew rate 2.5 mA 2.5 mA 2.5 mA 2.5 mA 2.5 mA
Supply voltage upper limit 6.6 V 6.6 V 6.6 V 6.6 V 6.6 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Nominal Uniform Gain Bandwidth 2500 kHz 2500 kHz 2500 kHz 2500 kHz 2500 kHz
Minimum voltage gain 50100 50100 50100 50100 50100
width 3 mm 3.899 mm 3.9 mm 3.9 mm 3.9 mm
Maximum average bias current (IIB) 0.0004 µA - 0.0004 µA 0.0004 µA 0.0004 µA
Peak Reflow Temperature (Celsius) 260 260 260 - -
Nominal slew rate 1.1 V/us - 1.1 V/us 1.1 V/us 1.1 V/us
Maximum time at peak reflow temperature 40 40 NOT SPECIFIED - -
micropower - NO NO NO NO
power - NO NO NO NO
Programmable power - NO NO NO NO
broadband - NO NO NO NO
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