MCC
Micro Commercial Components
TM
omponents
20736 Marilla
Street Chatsworth
!"#
$
% !"#
Features
•
•
•
•
•
•
Halogen
free available upon request by adding suffix "-HF"
Through Hole Package
Capable of 830mWatts of Power Dissipation
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
BC636-10
BC636-16
BC638
BC640
PNP Epitaxial
Silicon Transistors
TO-92
Maximum Ratings
Symbol
V
CEO
V
CBO
Collector-Base Voltage
Rating
Collector-Emitter Voltage
BC636
BC638
BC640
BC636
BC638
BC640
Value
-45
-60
-100
-45
-60
-80
-5.0
-1.0
-100
-65 to +150
-65 to +150
Unit
V
V
V
V
V
V
V
A
mA
℃
℃
A
E
B
V
EBO
I
C
I
B
T
J
T
STG
Emitter-Base Voltage
Collector Current
Base Current
Junction Temperature
Storage Temperature
Electrical Characteristics @ 25°C Unless Otherwise Specified
Symbol
Parameter
Collector-Emitter Breakdown Voltage
(I
C
=-1mAdc,I
B
=0)
BC636
BC638
BC640
Collector Cutoff Current
(V
CB
=-30Vdc, I
E
=0)
Emitter Cutoff Current
(V
EB
=-5.0Vdc, I
C
=0)
DC Current Gain
(V
CE
=-2Vdc, I
C
=-5mAdc)
DC Current Gain
(V
CE
=-2Vdc, I
C
=-150mAdc) BC636-10
BC636-16,BC638 ,BC640
DC Current Gain
(V
CE
=-2Vdc, I
C
=-500mAdc)
Collector-Emitter Saturation Voltage
(I
C
=-500mAdc,I
B
=-50mAdc)
Base-Emitter Voltage
(I
C
=-500mAdc, V
CE
=-2Vdc)
Transition Frequency
(V
CE
=-5.0Vdc, I
C
=-50mAdc, f=100MHz)
Min
Typ
Max
Unit
C
OFF CHARACTERISTICS
V
(BR)CEO
I
CBO
I
EBO
h
FE(1)
-45
-60
-80
---
---
40
63
100
25
---
---
100
---
---
---
-0.5
-1.0
---
Vdc
Vdc
MHz
DIM
A
B
C
D
E
G
INCHES
MIN
.175
.175
.500
.016
.135
.095
.173
---
---
Vdc
Vdc
Vdc
μAdc
μAdc
E
C
B
---
---
---
-0.1
-0.1
---
D
E
C
B
h
FE(2)
h
FE(3)
V
CE(sat)
V
BE(on)
f
T
160
250
G
STRAIGHT LEAD BENT LEAD
BULK PACK
AMMO PACK
DIMENSIONS
MM
MAX
.185
.185
---
.020
.145
.105
.220
MIN
4.45
4.45
12.70
0.41
3.43
2.42
4.40
MAX
4.70
4.70
---
0.63
3.68
2.67
5.60
NOTE
Straight Lead
Bent Lead
* For ammo packing detailed specification, click here to visit our website
of product packaging for details.
www.mccsemi.com
Revision: C
1 of 2
2013/01/01
MCC
Micro Commercial Components
TM
Ordering Information :
Device
Part Number-AP
Part Number-BP
Note : Adding "-HF" suffix for halogen free, eg. Part Number-AP-HF
Packing
Ammo Packing:
20Kpcs/Carton
Bulk:
100Kpcs/Carton
***IMPORTANT NOTICE***
Micro Commercial Components Corp.
reserves the right to make changes without further notice to any product herein to
make corrections, modifications , enhancements , improvements , or other changes .
Micro Commercial Components
Corp .
does not assume any liability arising out of the application or use of any product described herein; neither does it
convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all
risks of such use and will agree to hold
Micro Commercial Components Corp .
and all the companies whose products are
represented on our website, harmless against all damages.
***LIFE SUPPORT***
MCC's products are not authorized for use as critical components in life support devices or systems without the express written
approval of Micro Commercial Components Corporation.
***CUSTOMER AWARENESS***
Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking
strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages
customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on
our web page cited
below.
Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine
parts, have full traceability, meet MCC's quality standards for handling and storage.
MCC will not provide any warranty
coverage or other assistance for parts bought from Unauthorized Sources.
MCC is committed to combat this global
problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized
distributors.
www.mccsemi.com
Revision: C
2 of 2
2013/01/01
3
Embedded System
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