REVISIONS
LTR
A
B
DESCRIPTION
Changes in accordance with N.O.R. 5962-R005-93.
Drawing updated to reflect current requirements. - ro
DATE (YR-MO-DA)
92-10-27
02-12-02
APPROVED
M. A. FRYE
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
DAN WONNELL
B
1
B
2
B
3
B
4
B
5
B
6
B
7
B
8
B
9
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, TRANSISTOR ARRAY,
MONOLITHIC SILICON
DRAWING APPROVAL DATE
92-08-27
AMSC N/A
REVISION LEVEL
B
SIZE
A
SHEET
CAGE CODE
67268
1 OF
9
5962-89876
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E104-03
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89876
01
E
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
2023
Circuit function
7 gate darlington transistor array
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
Terminals
16
16
Package style
Dual-in-line
Flat pack
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Output voltage (VCE) .......................................................................
Input voltage (VIN) ...........................................................................
Peak output current (IOUT) ..............................................................
Ground terminal current (IGND) .......................................................
Continuous input current (IIN) ..........................................................
Power dissipation (PD):
Case outline E ..............................................................................
Case outline F ...............................................................................
Storage temperature range ..............................................................
Junction temperature (TJ) ................................................................
Thermal resistance, junction-to-case (θJC) ......................................
Thermal resistance, junction-to-ambient (θJA)
Case outline E ..............................................................................
Case outline F ...............................................................................
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
) ...................................... -55°C to +125°C
____
1/ Absolute maximum rating for power dissipation is for one darlington pair only.
Derate case outline E at 12.5 mW/°C above +25°C ambient. Derate case outline F at 8.7 mW/°C above +25°C ambient.
95 V dc
30 V dc
500 mA
3.0 A
25 mA
1.0 W 1/
1.09 W 1/
-65°C to +150°C
+175°C
See MIL-STD-1835
80°C/W
115°C/W
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89876
SHEET
B
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Switching test circuit and waveforms. Switching test circuit and waveforms shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89876
SHEET
B
3
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
100
1.8
1.5
1.3
Unit
Output leakage current
Collector emitter
saturation voltage
I
CEX
V
CE(sat)
V
CE
= 95 V
I
C
= 350 mA, I
B
= 500
µA
I
C
= 200 mA, I
B
= 350
µA
I
C
= 100 mA, I
B
= 250
µA
I
C
= 350 mA, I
B
= 500
µA
I
C
= 200 mA, I
B
= 350
µA
I
C
= 100 mA, I
B
= 250
µA
I
C
= 350 mA, I
B
= 850
µA
I
C
= 200 mA, I
B
= 550
µA
I
C
= 100 mA, I
B
= 350
µA
1,2,3
2
01
01
µA
V
1
1.6
1.3
1.1
3
1.8
1.5
1.3
Input voltage
V
IN(ON)
V
CE
= 2.0 V, I
C
= 200 mA
V
CE
= 2.0 V, I
C
= 250 mA
V
CE
= 2.0 V, I
C
= 300 mA
V
CE
= 2.0 V, I
C
= 200 mA
V
CE
= 2.0 V, I
C
= 250 mA
V
CE
= 2.0 V, I
C
= 300 mA
2
01
2.4
2.7
3.0
V
1,3
3.3
3.6
3.9
Input current
Input current
I
IN(ON)
I
IN(OFF)
V
IN
= 3.85 V
IC = 500
µA
1,2,3
2
01
01
650
20
1350
µA
µA
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89876
SHEET
B
4
TABLE I. Electrical performance characteristics – Continued.
Conditions
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
50
2.0
1000
1000
Unit
Clamp diode leakage
current
Clamp diode forward
leakage
Turn-on delay time
Turn-off delay time
I
R
V
F
t
PHL
t
PLH
V
R
= 95 V
I
F
= 350 mA
See figure 2
See figure 2
1,2,3
1,2,3
9,10,11
9,10,11
01
01
01
01
µA
V
ns
ns
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-
38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89876
SHEET
B
5
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