CHIP INDUCTOR
SPEER ELECTRONICS, INC.
KQ1008
THIN FILM CHIP INDUCTOR
CHIP INDUCTOR
- Surface Mount 1008 Style
- Flat top suitable for High Speed Pick and
Place Components
- Excellent High Frequency Applications
CHIP
INDUCTORS
- High Q Factors and Self-Resonant
Frequency Values
- Inductance Value Marked on Part
- SMT Lab Kit Available
DIMENSIONS
H
W
MARKING ON INDUCTOR CHIP
Wt.
L
Ht.
VALUE
10nH to 82nH
0.1uH to 1.0uH
CODE
10N to 82N
R10 to 1R0 “R” indicates the decimal point
No tolerance of inductance shall be indicated.
DIMENSIONS
MM
INCH
L
2.5
±0.2
W
2.2
±0.2
Wt
2.0
±0.1
H
1.8
±0.2
Ht
0.45
±0.15
.098
0.87
.079
.071
.018
±0.008
±0.004
±0.006
ORDERING & SPECIFYING INFORMATION*
KQ
Type
Air Core
Winding Form
1008
Size Code
0.98 x .087 x .071 in.
2.5 x 2.2 x 1.8 mm
TE
Packaging
TE: Embossed Taping
None: Bulk
10N
Nominal Inductance
10N : 10nH
R10 : 0.1uH
1R0 : 1.0 uH
K
Tolerance
G:
±2%
J:
±5%
K:
±10%
M:
±20%
*Please Note: KSE’s Part Numbers Do Not Contain any Spaces or Hyphens.
TELEPHONE:
814-362-5536
59
FAX:
814-362-8883
CHIP INDUCTOR
SPEER ELECTRONICS, INC.
KQ0402/KQ0603/KQ0805/KQ1008
MAXIMUM
v
L
No evidence of flaming,
fuming, or breakdown
1000MΩ and over
IEC 695-2-2
No evidence of
damage
No evidence of
breakdown
ENVIRONMENTAL & MECHANICAL CHARACTERISTICS
PARAMETER
Dielectric
Withstanding Voltage
Insulation Resistance
Flammability
Terminal
Pull Strength
Terminal
Bending Strength
TEST METHODS
5 seconds at DC 500V applied
between both terminals and film.
1 minute at DC 100V measured
between both terminals and film.
Withstands needle-flame test.
Terminals shall withstand a pull of
10 N in a horizontal direction
Specimen shall be soldered
on bend test board and force applied to the
opposite side to cause a 10mm deflection
(KQ0603 - 3mm deflection)
2 hours in each direction of
X, Y, Z, on PCB at a frequency
range of 10 - 55 - 10Hz with
1.5mm amplitude
Dropping 1m on the ground of
concrete 1 time.
Immerse in solder at 260
±
5°C
for 10
±
1 seconds
Immerse in the solder at 230
±
5°C
for 3
±
0.5 seconds
Accordance with MIL -STD - 202
Method 215
Store at -40
±
2°C, for 1000 hours
Store at +125
±
2°C, for 1000 hours
Temperature 40
±
2°C, 90-95%RH
for 1000 hours
Biased to full rated current at
+125°C for 1000 hours
Biased to 10% rated current at
+85°C, 85% RH for 1000 hours
100 cycles between
-40°C/hour and + 125°C/hour
v
L/L to be measured at the
temperatures between -40°C and
+125°C as based on the inductance
at 20°C
Vibration
v
L/L within
±5%
v
Q/Q within
±10%
Dropping
Resistance to
Soldering Heat
Solderability
Resistance to
Solvents
Low Temperature
Storage
High Temperature
Storage
Moisture Endurance
Load Life
High Temperature
High Humidity
Thermal Shock
Temperature
Characteristics
No evidence of damage
v
L/L within
±5%
v
Q/Q within
±10%
No evidence of outer damage
v
L/L within
±5%
v
Q/Q within
±10%
95% of the terminal should be
covered with new solder
No damage and marking
must remain legible
No evidence of damage
v
L/L within
±5%
v
Q/Q within
±10%
No evidence of damage
v
L/L within
±5%
v
Q/Q within
±10%
No evidence of damage
v
L/L within
±5%
v
Q/Q within
±10%
No evidence of damage
v
L/L within
±5%
v
Q/Q within
±10%
No evidence of damage
v
L/L within
±5%
v
Q/Q within
±10%
No evidence of damage
v
L/L within
±5%
v
Q/Q within
±10%
v
L/L within
±5%
Unless otherwise specified, measurements shall be performed within 2 hours after leaving test samples for more than one hour at the
normal temperature and at the normal humidity.
TELEPHONE:
814-362-5536
61
FAX:
814-362-8883
CHIP
INDUCTORS
NXP MCU
京公网安备 11010802033920号
EEWORLD
