Freescale Semiconductor
MC9S08SG32
Rev. 8.1, 03/2012
MC9S08SG32 DataSheet
Addendum
by: Microcontroller Solutions Group
This is the MC9S08SG32 DataSheet set consisting of the following files:
• MC9S08SG32 DataSheet Addendum, Rev 1
• MC9S08SG32 DataSheet, Rev 8
© Freescale Semiconductor, Inc., 2012. All rights reserved.
Freescale Semiconductor
Addendum
MC9S08SG32AD
Rev. 1, 02/2012
MC9S08SG32 Data Sheet
Addendum
by: Microcontroller Solutions Group
This errata document describes updates to the
MC9S08SG32 Data Sheet,
order number MC9S08SG32.
For convenience, the addenda items are grouped by
revision. Please check our website at
http://www.freescale.com for the latest updates.
Table of Contents
1
2
Addendum for Revision 8.0. . . . . . . . . . . . . . . . . . 2
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . 2
© Freescale Semiconductor, Inc., 2012. All rights reserved.
Addendum for Revision 8.0
1
Addendum for Revision 8.0
Table 1. MC9S08SG32 Rev. 1 Addendum
Location
Description
In Figure 4-1. MC9S08SG32/MC9S08SG16 Memory Map for device MC9S08SG16 change the
Chapter “Memory”/ Section
“MC9S08SG32 Series
value of “Unimplemented Bytes” from “26,538” to “26,528”.
Memory Map”/Figure 4-1.
0x0000
0x0000
MC9S08SG32/MC9S08SG16
DIRECT PAGE REGISTERS
DIRECT PAGE REGISTERS
0x007F
0x007F
Memory Map/Page 39
0x0080
0x0080
RAM
1024 BYTES
0x047F
0x0480
0x17FF
0x1800
0x185F
0x1860
UNIMPLEMENTED
0x7FFF
0x8000
26,528 BYTES
0x7FFF
0x8000
0x047F
0x0480
0x17FF
0x1800
0x185F
0x1860
UNIMPLEMENTED
26,528 BYTES
RAM
1024 BYTES
UNIMPLEMENTED
4992 BYTES
HIGH PAGE REGISTERS
UNIMPLEMENTED
4992 BYTES
HIGH PAGE REGISTERS
UNIMPLEMENTED
16,384 BYTES
FLASH
32768 BYTES
0xBFFF
0xC000
FLASH
16,384 BYTES
0xFFFF
0xFFFF
MC9S08SG32
MC9S08SG16
MC9S08SG32 Data Sheet Addendum, Rev. 1
2
Freescale Semiconductor
Addendum for Revision 8.0
Table 1. MC9S08SG32 Rev. 1 Addendum
Location
Description
Chapter “Electrical
Update Table A-3. Thermal Characteristics as follows:
Characteristics”/Section
• —Change the value for row “Thermal resistance,Single-layer board/28-pin TSSOP/Airflow
“Thermal
@200ft/min.” from 71 to 72 C/W
Characteristics”/Table A-3.
—Change the value for 16-pin TSSOP/Thermalresistance
Thermal Characteristics/Page
1.Single layer board / Airflow @ 200ft/min. from 108 to 113 C/W.
293
2.Four layer board / Airflow @ 200ft/min. from 78 to 84 C/W.
• Update parameter 4 of Table “A-3.Thermal Characteristics” .
Chapter “Electrical
Characteristics”/Section “DC
Characteristics”/Table A-6. DC
Characteristics/Page 298
In the Table “DC Characteristics” add note 11 and 12 for parameter #18.
Note 11: Device functionality is guaranteed between the LVD threshold VLVD0 and VDD Min.
When VDD is below the minimum operating voltage (VDD Min), the analog parameters for the
IO pins, ACMP and ADC, are not guaranteed to meet data sheet performance parameters.
Note 12: In addition to LVD, it is recommended to also use the LVW feature. LVW can trigger an
interrupt and be used as an indicator to warn that the VDD is dropping,so that the software can
take actions accordingly before the VDD drops below VDD Min.
MC9S08SG32 Data Sheet Addendum, Rev. 1
Freescale Semiconductor
3
Revision History
Table 1. MC9S08SG32 Rev. 1 Addendum
Location
Chapter “Electrical
Characteristics”/Section
“Flash Specifications”/Table
“A-16. Flash
Characteristics”/Page 323
Description
In Table A-16 Flash Characteristics/row 9/column "Characteristic", change the temperature
parameter names as follows:
Standard: -40
o
C to +125
o
C
HT: -40
o
C to +150
o
C
T = 25
o
C
2
Revision History
Table 2. Revision History Table
Rev. Number
1.0
Substantive Changes
• Initial release.
Changes done in Chapter “Electrical Characteristics”.
Date of Release
02/2012
Table 2
provides a revision history for this document.
MC9S08SG32 Data Sheet Addendum, Rev. 1
4
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