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HY5V58BF-H

Description
Synchronous DRAM, 32MX8, 5.4ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54
Categorystorage    storage   
File Size269KB,14 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
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HY5V58BF-H Overview

Synchronous DRAM, 32MX8, 5.4ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54

HY5V58BF-H Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeBGA
package instructionTFBGA, BGA54,9X9,32
Contacts54
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PBGA-B54
JESD-609 codee1
length13.5 mm
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals54
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA54,9X9,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height1.07 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.001 A
Maximum slew rate0.22 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
HY5V58B(L)F
4Banks x 8M x 8bits Synchronous DRAM
DESCRIPTION
The Hynix HY5V58B(L)F is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applica-
tions which require large memory density and high bandwidth. HY5V58B(L)F is organized as 4banks of 8,388,608x8.
HY5V58B(L)F is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs
are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high
bandwidth. All input and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count
sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate
command or can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined
design is not restricted by a `2N` rule.)
FEATURES
Single 3.3±0.3V power supply
All device Balls are compatible with LVTTL interface
54Ball FBGA With 0.8mm of ball pitch
All inputs and outputs referenced to positive edge of
system clock
Data mask function by DQM
Internal four banks operation
Programmable CAS Latency ; 2, 3 Clocks
Auto refresh and self refresh
8192 refresh cycles / 64ms
Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or Full Page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
ORDERING INFORMATION
Part No.
HY5V58BF-H
HY5V58BF-8
HY5V58BF-P
HY5V58BF-S
HY5V58B(L)F-H
HY5V58B(L)F-8
HY5V58B(L)F-P
HY5V58B(L)F-S
Clock Frequency
133MHz
125MHz
100MHz
100MHz
133MHz
125MHz
100MHz
100MHz
Power
Organization
Interface
Package
Normal
4Banks x 8Mbits
x8
Low power
LVTTL
54ball FBGA
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev. 0.1/Apr. 02
2

HY5V58BF-H Related Products

HY5V58BF-H HY5V58BF-8 HY5V58BF-P HY5V58BF-S HY5V58BLF-8 HY5V58BLF-P HY5V58BLF-S HY5V58BLF-H
Description Synchronous DRAM, 32MX8, 5.4ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54 Synchronous DRAM, 32MX8, 6ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54 Synchronous DRAM, 32MX8, 6ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54 Synchronous DRAM, 32MX8, 6ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54 Synchronous DRAM, 32MX8, 6ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54 Synchronous DRAM, 32MX8, 6ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54 Synchronous DRAM, 32MX8, 6ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PBGA54, 8 X 13.50 MM, 0.80 MM PITCH, FBGA-54
Maker SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix SK Hynix
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA
package instruction TFBGA, BGA54,9X9,32 TFBGA, BGA54,9X9,32 TFBGA, BGA54,9X9,32 TFBGA, BGA54,9X9,32 TFBGA, BGA54,9X9,32 TFBGA, BGA54,9X9,32 TFBGA, BGA54,9X9,32 TFBGA, BGA54,9X9,32
Contacts 54 54 54 54 54 54 54 54
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 5.4 ns 6 ns 6 ns 6 ns 6 ns 6 ns 6 ns 5.4 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 133 MHz 125 MHz 100 MHz 100 MHz 125 MHz 100 MHz 100 MHz 133 MHz
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
interleaved burst length 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 code R-PBGA-B54 R-PBGA-B54 R-PBGA-B54 R-PBGA-B54 R-PBGA-B54 R-PBGA-B54 R-PBGA-B54 R-PBGA-B54
JESD-609 code e1 e1 e1 e1 e1 e1 e1 e1
length 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm
memory density 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 54 54 54 54 54 54 54 54
word count 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words 33554432 words
character code 32000000 32000000 32000000 32000000 32000000 32000000 32000000 32000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 32MX8 32MX8 32MX8 32MX8 32MX8 32MX8 32MX8 32MX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA
Encapsulate equivalent code BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32 BGA54,9X9,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 8192 8192 8192 8192 8192 8192
Maximum seat height 1.07 mm 1.07 mm 1.07 mm 1.07 mm 1.07 mm 1.07 mm 1.07 mm 1.07 mm
self refresh YES YES YES YES YES YES YES YES
Continuous burst length 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.22 mA 0.2 mA 0.2 mA 0.2 mA 0.2 mA 0.2 mA 0.2 mA 0.22 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm
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