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AS29F040CW-70/XT

Description
Flash, 512KX8, 70ns, CDIP32, DIP-32
Categorystorage    storage   
File Size1001KB,27 Pages
ManufacturerMicross
Websitehttps://www.micross.com
Download Datasheet Parametric View All

AS29F040CW-70/XT Overview

Flash, 512KX8, 70ns, CDIP32, DIP-32

AS29F040CW-70/XT Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicross
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time70 ns
command user interfaceYES
Data pollingYES
Durability1000000 Write/Erase Cycles
JESD-30 codeR-CDIP-T32
length42.418 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size8
Number of terminals32
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Department size64K
Maximum standby current0.000005 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width15.24 mm
FLASH
AS29F040
512K x 8 FLASH
UNIFORM SECTOR 5.0V FLASH
MEMORY
AVAILABLE AS MILITARY
SPECIFICATIONS
• MIL-STD-883
• SMD 5962-96692
PIN ASSIGNMENT
(Top View)
32-PIN Ceramic DIP (CW)
32-pin Flatpack (F)
32-pin Lead Formed Flatpack (DCG)
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
WE\
A17
A14
A13
A8
A9
A11
OE\
A10
CE\
DQ7
DQ6
DQ5
DQ4
DQ3
FEATURES
• Single 5.0V ±10% power supply operation
• Fastest access times: 55, 60, 70, 90, 120, & 150ns
• Low power consumption:
20 mA typical active read current
30 mA typical program/erase current
1
μA
typical standby current (standard access time to
active mode)
• Flexible sector architecture
Eight uniform 64 Kbyte each
Any combination of sectors can be erased
Supports full chip erase
• Sector protection
• Embedded Algorithms Erase & Program Algorithms
• Erase Suspend/Resume
• Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
• Compatible with JEDEC standards
Pinout and software compatible with single-power-
supply FLASH
• Data\ Polling and Toggle Bits
• 20-year data retention at 125°C
32-PAD Ceramic LCC (ECA)
A12
A15
A16
A18
VCC
WE\
A17
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
4 3 2
32 31 30
5
29
1
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
A14
A13
A8
A9
A11
OE\
A10
CE\
I/O 7
OPTIONS
OPTIONS
• Timing
55ns
60ns
70ns
90ns
120ns
150ns
MARKING
CW
F
DCG
ECA
IT
XT**
883C
Q
MARKING
-55
-60
-70
-90
-120
-150
• Package Type
Ceramic DIP (600 mil)
Flatpack
Lead Formed Flatpack
Leadless Chip Carrier
• Temperature Ranges
Industrial Temperature (-40°C to +85°C)
Military Temperature (-55°C to +125°C)
883C Processing (-55°C to +125°C)
QML Processing (-55°C to +125°C)
For more products and information
please visit our web site at
www.micross.com
AS29F040
Rev. 2.3 01/10
Micross Components reserves the right to change products or specifications without notice.
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