K3N3U3000D-AC950 datasheet, PDF

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K3N3U3000D-AC950: DescriptionMASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32; Categorystorage storage; File Size45KB，3 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K3N3U3000D-AC950 Overview

MASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32

K3N3U3000D-AC950 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	TSOP1
package instruction	TSOP1,
Contacts	32
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	95 ns
JESD-30 code	R-PDSO-G32
length	11.8 mm
memory density	4194304 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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K3N3V(U)3000D-AC(E)

4M-Bit (512Kx8) CMOS MASK ROM

FEATURES

•

524,288 x 8 bit organization

•

Fast access time(C

L

=30pF)

3.3V Operation : 85ns(Max.)

3.0V Operation : 95ns(Max.)

•

Supply voltage : single +3.0V/ single +3.3V

•

Current consumption

Operating : 25mA(Max.)

Standby : 30µA(Max.)

•

Fully static operation

•

All inputs and outputs TTL compatible

•

Three state outputs

•

Package

-. K3N3V(U)3000D-AC(E) : 32-sTSOP1-0813.4

CMOS MASK ROM

GENERAL DESCRIPTION

The K3N3V(U)3000D-AC(E) is fully static mask programma-

ble ROM organized 524,288 x 8 bit. It is fabricated using silicon

gate CMOS process technoiogy.

This device operates with 3.0V or 3.3V power supply, and all

inputs and outputs are TTL compatible.

Because of its asynchronous operation, it requires no external

clock assuring extremely easy operation.

It is suitable for use in program memory of microprocessor, and

data memory, character generator.

The K3N3V(U)3000D-AC(E) is packaged in a 32-sTSOP1.

FUNCTIONAL BLOCK DIAGRAM

A

18

X

BUFFERS

AND

DECODER

MEMORY CELL

MATRIX

(524,288x8)

PRODUCT INFORMATION

Product

Operating

Temp Range

0°C~70°C

-20°C~85°C

Vcc Range

(Typical)

3.3V/3.0V

Speed

(ns)

85/95

.

A

0

K3N3V(U)3000D-AC

K3N3V(U)3000D-AE

Y

BUFFERS

AND

DECODER

SENSE AMP.

BUFFERS

PIN CONFIGURATION

. . .

A

11

A

9

A

8

A

13

A

14

A

17

N.C

V

CC

A

18

A

16

#1

#32

OE

A

10

CE

Q

7

Q

6

Q

5

Q

4

CE

OE

CONTROL

LOGIC

Q

0

Q

7

32-sTSOP1

Q

3

V

SS

Q

2

Q

1

Q

0

A

0

A

1

A

2

Pin Name

A

0

- A

18

Q

0

- Q

7

CE

OE

V

CC

V

SS

N.C

Pin Function

Address Inputs

Data Outputs

Chip Enable

Output Enable

Power

Ground

No Connection

A

15

A

12

A

7

A

6

A

5

A

4

#16

#17

A

3

K3N3V(U)3000D-AC(E)

K3N3U3000D-AC950 Related Products

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Description	MASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	MASK ROM, 512KX8, 85ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32	MASK ROM, 512KX8, 85ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	MASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32	MASK ROM, 512KX8, 85ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32	MASK ROM, 512KX8, 85ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32	MASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32	MASK ROM, 512KX8, 95ns, CMOS, PDSO32, 8 X 13.40 MM, STSOP1-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
Parts packaging code	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
package instruction	TSOP1,	TSOP1, TSSOP32,.56,20	TSOP1,	TSOP1, TSSOP32,.56,20	TSOP1, TSSOP32,.56,20	TSOP1,	TSOP1, TSSOP32,.56,20	TSOP1,
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	95 ns	85 ns	85 ns	95 ns	85 ns	85 ns	95 ns	95 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
length	11.8 mm	11.8 mm	11.8 mm	11.8 mm	11.8 mm	11.8 mm	11.8 mm	11.8 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED	240	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.6 V	3.6 V	3.3 V	3.6 V	3.6 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	3 V	3 V	2.7 V	3 V	3 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3.3 V	3.3 V	3 V	3.3 V	3.3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	OTHER	OTHER	COMMERCIAL	COMMERCIAL	COMMERCIAL	OTHER	OTHER
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED
width	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm

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