ASMT-FJ30
Mini Surface Mount AF LED
Data Sheet
Description
Avago Technologies’ ASMT-FJ30-AB000 is a miniature SMT
(Surface Mount Technology) dome lamp uses an untint-
ed, non-diffused lens to provide a high luminous inten-
sity within a narrow radiation pattern. The device envi-
ronmental friendly green product of unique PCB based,
namely Miniature Surface Mount AF LED.
This lamp type LED utilizes Aluminum Indium Gallium
Phosphide (AlInGaP) material technology. The AlInGaP
material has a very high luminous efficiency, capable of
producing high light output over a wide range of drive
currents. The color available for this SMT Lamp package is
612nm Orange.
This narrow angle SMT lamp package is designed for ap-
plications that require long distance illumination and nar-
row beam pattern such as auxiliary flash for auto-focus
function in digital still camera etc. This miniature package
is suitable for applications that have constraint in design
area. In order to facilitate pick and place operation, this
SMT Lamp is shipped in tape and reel, with 1500 units per
reel.
This package is compatible with Pb-free reflow soldering
process.
Features
•
Smooth, Consistent Narrow Radiation Pattern
•
18
°
View Angle
•
3.2 L x 2.4 X 2.4H mm Package Dimension
•
Good Intensity Output
•
Compatible with 2x Solder Reflow
•
Clear, Non-diffused Epoxy
Applications
•
Camera
Eye Safety
These orange Miniature Surface Mount AF Lamps are use
for camera application. The LEDs have lenses, which fo-
cus the beam at about 10mm from the front of the lens,
from where the beam diverges relatively slowly. If the
LEDs were placed in a product, they would create a Class 1
LED to IEC/EN 60825-1 (2001) at the recommended input
current. As long as no collimating optics are added to the
optical path.
CAUTION:
ASMT-FJ30 LEDs are Class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appro-
priate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
1.80
0.55
SOLDERING
TERMINAL
0.55
0.50
3.20
Ø1.80
2.40
MOLDING
BODY (LENS)
LED DICE
Anode
MASK
2.20
P.C. BOARD
POLARITY
2.40
1.00
0.55
Notes:
1. All dimensions in millimeters.
2. Tolerance is ±0.1mm unless otherwise specified.
Device Selection Guide
Color
Orange
Part Number
ASMT-FJ30
Min. Iv (cd)
5.5
Test Current (mA)
20
Dice Technology
AlInGaP
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
package.
2. Iv Tolerance = ±15%
Absolute Maximum Ratings at T
A
= 25°C
Parameter
DC Forward Current
Power Dissipation
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
ASMT-FJ30
50
125
95
-40 to 85
-40 to 85
Units
mA
mW
°
C
°
C
°
C
refer reflow soldering profile (Figure 6)
2
Optical Characteristics at T
A
= 25°C
Peak Wavelength
λ
peak
(nm)
Part Number
ASMT-FJ30
Dominant Wavelength
λ
d [2]
(nm)
Typ.
605
Viewing Angle 2
θ
1/2 [4]
(Degrees)
Typ.
12
Color
Orange
Typ.
612
Notes:
1. The dominant wavelength,
λ
d
, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2. θ
1/2
is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristics at T
A
= 25°C
Forward Voltage
V
F
(Volts)
[1]
Color
Orange
Reverse Breakdown,
V
R
(Volts) @ I
R
= 100μA
Max.
2.4
Thermal Resistance
Rθ
J-PIN
(°C/W)
Typ.
300
Test Current
20mA
Typ.
2.1
Min.
5
1.2
RELATIVE LUMINOUS INTENSITY
NORMALIZED AT 20MA
1
RELATIVE INTENSITY
0.8
0.6
0.4
0.2
0
380
430
480
530 580 630
WAVELENGTH-nm
680
730
780
2.5
2
1.5
1
0.5
0
0
10
20
30
40
DC FORWARD CURRENT-mA
50
60
Figure 1. Relative Intensity Vs Wavelength
Figure 2. Luminous Intensity vs Forward Current
60
50
FORWARD CURRENT-mA
40
30
20
10
0
0
0.5
1
1.5
FORWARD VOLTAGE-V
2
2.5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90 -75 -60 -45 -30 -15 0 15 30
OFF AXIS ANGLE (°)
RELATIVE INTENSITY
45
60
75
90
Figure 3. Forward Current vs Forward Voltage
Figure 4. Vertical Radiation Pattern
3
51mcu
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