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SMDP-67204HV-15SCC

Description
Rad. Tolerant High Speed 4 Kb x 9 Parallel FIFO
Categorystorage    storage   
File Size2MB,20 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

SMDP-67204HV-15SCC Overview

Rad. Tolerant High Speed 4 Kb x 9 Parallel FIFO

SMDP-67204HV-15SCC Parametric

Parameter NameAttribute value
MakerAtmel (Microchip)
Parts packaging codeDFP
package instructionDFP, FL28,.4
Contacts28
Reach Compliance Codecompli
ECCN codeEAR99
Maximum access time15 ns
Other featuresRETRANSMIT
period time25 ns
JESD-30 codeR-XDFP-F28
memory density36864 bi
Memory IC TypeBI-DIRECTIONAL FIFO
memory width9
Number of functions1
Number of terminals28
word count4096 words
character code4000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4KX9
ExportableNO
Package body materialUNSPECIFIED
encapsulated codeDFP
Encapsulate equivalent codeFL28,.4
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height3.3 mm
Maximum standby current0.005 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
width10.16 mm
Features
First-in First-out Dual Port Memory
4096-bit x 9 Organization
Fast Flag and Access Times: 15, 30 ns
Wide Temperature Range: -55°C to +125°C
Fully Expandable by Word Width or Depth
Asynchronous Read/Write Operations
Empty, Full and Half Flags in Single Device Mode
Retransmit Capability
Bi-directional Applications
Battery Backup Operation: 2V Data Retention
TTL Compatible
Single 5V ± 10% Power Supply
No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm
2
Tested up to a Total Dose of 30 krads (Si) according to MIL STD 883 Method 1019
Quality grades : QML Q and V with SMD 5962-89568 and ESCCwith specification
9301/049
Rad. Tolerant
High Speed
4 Kb x 9
Parallel FIFO
M67204H
Description
The M67204H implements a first-in first-out algorithm, featuring asynchronous
read/write operations. The FULL and EMPTY flags prevent data overflow and under-
flow. The expansion logic allows unlimited expansion in word size and depth with no
timing penalties. Twin address pointers automatically generate internal read and write
addresses, and no external address information is required for the Atmel FIFOs.
address pointers are automatically incremented with the write pin and read pin. The 9
bits wide data are used in data communications applications where a parity bit for
error checking is necessary. The retransmit pin reset the read pointer to zero without
affecting the write pointer. This is very useful for retransmitting data when an error is
detected in the system.
Using an array of eight transistors (8T) memory cell, the M67204H combines an
extremely low standby supply current (typ = 0.1 µA) with a fast access time at 15 ns
over the full temperature range. All versions offer battery backup data retention capa-
bility with a typical power consumption at less than 2 µW.
The M67204H is processed according to the methods of the latest revision of the MIL
PRF 38535 (Q and V) or ESCC 9000.
4141J–AERO–04/07

SMDP-67204HV-15SCC Related Products

SMDP-67204HV-15SCC M67204H SMCP-67204HV-15SCC SMCP-67204HV-30SCC SMDP-67204HV-30SCC
Description Rad. Tolerant High Speed 4 Kb x 9 Parallel FIFO Rad. Tolerant High Speed 4 Kb x 9 Parallel FIFO Rad. Tolerant High Speed 4 Kb x 9 Parallel FIFO Rad. Tolerant High Speed 4 Kb x 9 Parallel FIFO Rad. Tolerant High Speed 4 Kb x 9 Parallel FIFO
Maker Atmel (Microchip) - Atmel (Microchip) - Atmel (Microchip)
Parts packaging code DFP - DIP DIP DFP
package instruction DFP, FL28,.4 - DIP, DIP28,.3 DIP, DIP28,.3 DFP, FL28,.4
Contacts 28 - 28 28 28
Reach Compliance Code compli - compliant compli compli
ECCN code EAR99 - EAR99 EAR99 EAR99
Maximum access time 15 ns - 15 ns 30 ns 30 ns
Other features RETRANSMIT - RETRANSMIT RETRANSMIT RETRANSMIT
period time 25 ns - 25 ns 40 ns 40 ns
JESD-30 code R-XDFP-F28 - R-CDIP-T28 R-CDIP-T28 R-XDFP-F28
memory density 36864 bi - 36864 bit 36864 bi 36864 bi
Memory IC Type BI-DIRECTIONAL FIFO - BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO BI-DIRECTIONAL FIFO
memory width 9 - 9 9 9
Number of functions 1 - 1 1 1
Number of terminals 28 - 28 28 28
word count 4096 words - 4096 words 4096 words 4096 words
character code 4000 - 4000 4000 4000
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C - 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C - -55 °C -55 °C -55 °C
organize 4KX9 - 4KX9 4KX9 4KX9
Exportable NO - NO NO NO
Package body material UNSPECIFIED - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
encapsulated code DFP - DIP DIP DFP
Encapsulate equivalent code FL28,.4 - DIP28,.3 DIP28,.3 FL28,.4
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK - IN-LINE IN-LINE FLATPACK
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL
power supply 5 V - 5 V 5 V 5 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 3.3 mm - 3.94 mm 3.94 mm 3.3 mm
Maximum standby current 0.005 A - 0.005 A 0.005 A 0.005 A
Maximum slew rate 0.12 mA - 0.12 mA 0.11 mA 0.11 mA
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V - 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V
surface mount YES - NO NO YES
technology CMOS - CMOS CMOS CMOS
Temperature level MILITARY - MILITARY MILITARY MILITARY
Terminal form FLAT - THROUGH-HOLE THROUGH-HOLE FLAT
Terminal pitch 1.27 mm - 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL - DUAL DUAL DUAL
width 10.16 mm - 7.62 mm 7.62 mm 10.16 mm

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