DS2009D-35 datasheet, PDF - EEWORLD Datasheet

DS2009D-35: DescriptionFIFO, 512X9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, DIP-28; Categorystorage storage; File Size366KB，14 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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DS2009D-35 Overview

FIFO, 512X9, 35ns, Asynchronous, CMOS, PDIP28, 0.300 INCH, DIP-28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Maxim
Parts packaging code	DIP
package instruction	0.300 INCH, DIP-28
Contacts	28
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	35 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	22.22 MHz
period time	45 ns
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	34.795 mm
memory density	4608 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	28
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512X9
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.572 mm
Maximum standby current	0.008 A
Maximum slew rate	0.1 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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