EEWORLDEEWORLDEEWORLD

Part Number

Search

DS2030Y-70#

Description
32KX8 NON-VOLATILE SRAM MODULE, 70ns, PBGA256, 27 X 27 MM, ROHS COMPLIANT, BGA-256
Categorystorage    storage   
File Size899KB,13 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Environmental Compliance  
Download Datasheet Parametric Compare View All

DS2030Y-70# Overview

32KX8 NON-VOLATILE SRAM MODULE, 70ns, PBGA256, 27 X 27 MM, ROHS COMPLIANT, BGA-256

DS2030Y-70# Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRochester Electronics
Parts packaging codeBGA
package instruction27 X 27 MM, ROHS COMPLIANT, BGA-256
Contacts256
Reach Compliance Codeunknown
Maximum access time70 ns
JESD-30 codeS-PBGA-B256
JESD-609 codee1
length27 mm
memory density262144 bit
Memory IC TypeNON-VOLATILE SRAM MODULE
memory width8
Humidity sensitivity levelNOT SPECIFIED
Number of functions1
Number of terminals256
word count32768 words
character code32000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)245
Certification statusCOMMERCIAL
Maximum seat height8.72 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width27 mm
D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec

DS2030Y-70# Related Products

DS2030Y-70# DS2030Y-100# DS2030AB-100# DS2030AB-70#
Description 32KX8 NON-VOLATILE SRAM MODULE, 70ns, PBGA256, 27 X 27 MM, ROHS COMPLIANT, BGA-256 32KX8 NON-VOLATILE SRAM MODULE, 100ns, PBGA256, 27 X 27 MM, ROHS COMPLIANT, BGA-256 32KX8 NON-VOLATILE SRAM MODULE, 100ns, PBGA256, 27 X 27 MM, ROHS COMPLIANT, BGA-256 32KX8 NON-VOLATILE SRAM MODULE, 70ns, PBGA256, 27 X 27 MM, ROHS COMPLIANT, BGA-256
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code BGA BGA BGA BGA
package instruction 27 X 27 MM, ROHS COMPLIANT, BGA-256 27 X 27 MM, ROHS COMPLIANT, BGA-256 27 X 27 MM, ROHS COMPLIANT, BGA-256 27 X 27 MM, ROHS COMPLIANT, BGA-256
Contacts 256 256 256 256
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 70 ns 100 ns 100 ns 70 ns
JESD-30 code S-PBGA-B256 S-PBGA-B256 S-PBGA-B256 S-PBGA-B256
JESD-609 code e1 e1 e1 e1
length 27 mm 27 mm 27 mm 27 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE
memory width 8 8 8 8
Humidity sensitivity level NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Number of functions 1 1 1 1
Number of terminals 256 256 256 256
word count 32768 words 32768 words 32768 words 32768 words
character code 32000 32000 32000 32000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 32KX8 32KX8 32KX8 32KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 245 245 245 245
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 8.72 mm 8.72 mm 8.72 mm 8.72 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30
width 27 mm 27 mm 27 mm 27 mm
Domestic DCDC
What is the quality of domestically produced DCDC now?...
hinii23 Power technology
Some small experiences in using TEMS
...
banana RF/Wirelessly
TI Single-Cell Fuel Gauge Basic Introduction and FAQs
[align=left]The gas gauge /fuel gauge is used to measure and display the battery power, usually including mAh remaining capacity (RM), full charge capacity (FCC), percentage capacity (SOC), voltage, c...
qwqwqw2088 Analogue and Mixed Signal
MSP432P401R LaunchPad Review: Affordable and High-Quality M4 MCU
[url]https://store.ti.com/Members/MyOrder.aspx?OrderNumber=612495&OrderId=640406[/url]...
颜明远 Microcontroller MCU
What is the difference between hot ground and cold ground in a power supply?
Hello everyone~ When I was reading an article, I saw the mention of hot ground and cold ground. I wanted to ask everyone, what is the difference between the two? When I was in school, I knew about dig...
ohahaha Power technology
MCU airplane game sample and mobile phone input method sample
MCU airplane game sample and mobile phone input method sample...
bboyfeiyu 51mcu

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2754  124  2474  1411  2045  56  3  50  29  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号