D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, HERMETIC SEALED, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Spectrum Microwave |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.6 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Maximum analog output voltage | 10 V |
| Minimum analog output voltage | -10 V |
| Converter type | D/A CONVERTER |
| Enter bit code | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
| Input format | PARALLEL, WORD |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| length | 31.75 mm |
| Maximum linear error (EL) | 0.012% |
| Nominal negative supply voltage | -15 V |
| Number of digits | 12 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5,+-15 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.65 mm |
| Maximum stabilization time | 7 µs |
| Nominal settling time (tstl) | 5 µs |
| Maximum slew rate | 20 mA |
| Nominal supply voltage | 15 V |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| DAC88E | DAC88H | DAC88H/BCH | DAC88H/B | DAC88 | |
|---|---|---|---|---|---|
| Description | D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, HERMETIC SEALED, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | D/A Converter, 1 Func, Parallel, Word Input Loading, 5us Settling Time, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 |
| Maker | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave | Spectrum Microwave |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Contacts | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| Maximum analog output voltage | 10 V | 10 V | 10 V | 10 V | 10 V |
| Minimum analog output voltage | -10 V | -10 V | -10 V | -10 V | -10 V |
| Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Enter bit code | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY | COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY |
| Input format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| JESD-30 code | R-XDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 | R-CDIP-T24 |
| length | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm |
| Maximum linear error (EL) | 0.012% | 0.0122% | 0.0122% | 0.0122% | 0.0122% |
| Nominal negative supply voltage | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of digits | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 85 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -25 °C | -55 °C | -55 °C | -55 °C | - |
| Package body material | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 | DIP24,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.65 mm | 4.65 mm | 4.65 mm | 4.65 mm | 4.65 mm |
| Maximum stabilization time | 7 µs | 7 µs | 7 µs | 7 µs | 7 µs |
| Nominal settling time (tstl) | 5 µs | 5 µs | 5 µs | 5 µs | 5 µs |
| Nominal supply voltage | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| Temperature level | OTHER | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| ECCN code | - | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - |