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M30260F6AGP-D3

Description
IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size179KB,26 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

M30260F6AGP-D3 Overview

IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC

M30260F6AGP-D3 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
package instructionQFP, QFP48,.35SQ,20
Reach Compliance Codeunknown
bit size16
CPU seriesM16C
JESD-30 codeS-PQFP-G48
Number of terminals48
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP48,.35SQ,20
Package shapeSQUARE
Package formFLATPACK
power supply3.3/5 V
Certification statusNot Qualified
RAM (bytes)2048
rom(word)53248
ROM programmabilityFLASH
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
M16C/26A Group (M16C/26A, M16C/26T)
SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER
REJ03B0071-0040Z
Rev.0.40
2004.07.30
1. Overview
The M16C/26A group (M16C/26A, M16C/26T) of single-chip microcomputers is built using the high-perfor-
mance silicon gate CMOS process using a M16C/60 Series CPU core and is packaged in a 42-pin and 48-
pin plastic molded QFP. These single-chip microcomputers operate using sophisticated instructions featur-
ing a high level of instruction efficiency. With 1M bytes of address space, they are capable of executing
instructions at high speed. In addition, this microcomputer contains a multiplier and a DMAC which com-
bined with fast instruction processing capability, makes it suitable for control of various OA, communication,
and industrial equipment which requires high-speed arithmetic/logic operations.
There is a Normal-ver. for M16C/26A and T-ver. and v-ver. for M16C/26T.
1.1 Applications
Audio, cameras, office equipment, communications equipment, portable equipment,
home appliances (inverter solution), auotmotives, etc
------Table of Contents------
Specifications written in this manual are believed to be accurate, but are
not guaranteed to be entirely free of error. Specifications in this manual
may be changed for functional or performance improvements. Please make
sure your manual is the latest edition.
Rev.0.40 2004.07.30
REJ03B0071-0040Z
page 1 of 24

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Description IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,SOP,42PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,SOP,42PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,SOP,42PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC IC,MICROCONTROLLER,16-BIT,M16C CPU,CMOS,QFP,48PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
package instruction QFP, QFP48,.35SQ,20 SSOP, SOP42,.4,32 QFP, QFP48,.35SQ,20 QFP, QFP48,.35SQ,20 QFP, QFP48,.35SQ,20 SSOP, SOP42,.4,32 SSOP, SOP42,.4,32 QFP, QFP48,.35SQ,20 QFP, QFP48,.35SQ,20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
bit size 16 16 16 16 16 16 16 16 16
CPU series M16C M16C M16C M16C M16C M16C M16C M16C M16C
JESD-30 code S-PQFP-G48 R-PDSO-G42 S-PQFP-G48 S-PQFP-G48 S-PQFP-G48 R-PDSO-G42 R-PDSO-G42 S-PQFP-G48 S-PQFP-G48
Number of terminals 48 42 48 48 48 42 42 48 48
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QFP SSOP QFP QFP QFP SSOP SSOP QFP QFP
Encapsulate equivalent code QFP48,.35SQ,20 SOP42,.4,32 QFP48,.35SQ,20 QFP48,.35SQ,20 QFP48,.35SQ,20 SOP42,.4,32 SOP42,.4,32 QFP48,.35SQ,20 QFP48,.35SQ,20
Package shape SQUARE RECTANGULAR SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE SQUARE
Package form FLATPACK SMALL OUTLINE, SHRINK PITCH FLATPACK FLATPACK FLATPACK SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH FLATPACK FLATPACK
power supply 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (bytes) 2048 1024 1024 2048 2048 2048 2048 1024 1024
rom(word) 53248 36864 28672 69632 49152 69632 49152 36864 36864
ROM programmability FLASH FLASH FLASH FLASH MROM FLASH MROM FLASH FLASH
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm
Terminal location QUAD DUAL QUAD QUAD QUAD DUAL DUAL QUAD QUAD
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