TO-220 & TO-218 & TO-247 Heat Sinks
SW25, SW38, SW50, SW63
Extruded heat sink with unequal channel widths
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
SW25
SW38
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
SW50
SW63
2
4
6
Heat Dissipated—Watts
8
10
2
4
6
Heat Dissipated—Watts
8
10
Air Velocity—Feet Per Minute
400
200
600
800
1000
10
8
6
4
2
0
6.25
(0.246)
12.50
(0.492)
THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES
Grease
&
Epoxy
page112
34.50
(1.358)
2.00
(0.079)
Mounting
Kits
page 99
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
SEE NOTE 1
8
6
4
2
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Extruded heat sink with unequal
channel widths front and back
can accommodate a TO-220, TO-218,
or TO-247 devices. Includes two solder-
able mounting pins which permit verti-
cal mounting and eliminate stress on
device leads. Available in three heights.
Version without hole uses clip 5901
(sold separately) to attach device.
See page 97 for clip information.
Air Velocity—Feet Per Minute
400
200
600
800
1000
10
"A"
25.00
(0.984) 19.90
(0.783) 15.00
(0.591)
4.00
(0.157)
ø 3.20
(0.126) TYP
2.50
(0.098)
25.40
(1.000)
ORDERING INFORMATION
Part Number
SW25-2G
SW25-4G
SW38-2G
SW38-4G
SW50-2G
SW50-4G
SW63-2G
SW63-4G
Description
Extruded heat sink with unequal channel widths front and back
With device mounting holes
Extruded heat sink with unequal channel widths front and back
With device mounting holes
Extruded heat sink with unequal channel widths front and back
With device mounting holes
Extruded heat sink with unequal channel widths front and back
With device mounting holes
“A” Dim
25.00 (0.984)
25.00 (0.984)
38.00 (1.496)
38.00 (1.496)
50.00 (1.968)
50.00 (1.968)
63.00 (2.480)
63.00 (2.480)
Holes
No
Yes
No
Yes
No
Yes
No
Yes
Dia of PCB
Plated Thru
Hole for Pins
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
3.00 (0.118)
Material: Aluminum
Finish: Black Anodize
NOTE 1: This hole not present in SW25 model
5297, 5298, 5299, 5300
Extruded heat sink with large radial fins
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
4
52970X
52980X
0
100
Mounting Surface Temp
Rise Above Ambient—°C
80
60
40
20
0
0
52990X
53000X
4
8
12
Heat Dissipated—Watts
Dia of PCB
Plated Thru
Hole for Pins
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
2.67 (0.105)
16
20
8
12
Heat Dissipated—Watts
16
20
Air Velocity—Feet Per Minute
400
200
600
800
1000
4
3
2
1
0
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
5
20.96
(0.825)
Grease
&
Epoxy
page112
Mounting
Kits
page 99
"C"
"A"
Thermal Resistance From MTG
Surface to Ambient—°C/Watt
Extruded heat sink with large radial
fins
features equal channel widths on
both sides for single or dual device
mounting. Includes two solderable
mounting pins which permit vertical
mounting and eliminate stress on
device leads. Available in four heights
for TO-220, TO-218, and TO-247 devices.
Air Velocity—Feet Per Minute
400
200
600
800
"B"
1000
5
4
3
2
1
0
3.18
(0.125)
14.22
(0.560)
3.96
(0.156)
2x
13.72
(0.540)
25.40
(1.000)
ø 2.36
(0.093) 2x
1.57
(0.062)
25.40
(1.000)
ORDERING INFORMATION
Part Number
529701B02500G
529702B02500G
529801B02500G
529802B02500G
529901B02500G
529902B02500G
530001B02500G
530002B02500G
Device
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
TO-218, TO-247
TO-220
“A” Dim
25.40 (1.000)
25.40 (1.000)
38.10 (1.500)
38.10 (1.500)
50.80 (2.000)
50.80 (2.000)
63.50 (2.500)
63.50 (2.500)
“B” Dim
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
21.59 (0.850)
18.29 (0.720)
“C” Dim
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
3.66 (0.144)
3.17 (0.125)
17.02
(0.670)
41.91
(1.650)
Material: Aluminum
Finish: Black Anodize
For additional options see page 83
56
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