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BOXPODP5V-133

Description
Microprocessor, 133MHz, BICMOS, CPGA387
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size573KB,18 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

BOXPODP5V-133 Overview

Microprocessor, 133MHz, BICMOS, CPGA387

BOXPODP5V-133 Parametric

Parameter NameAttribute value
MakerIntel
package instructionPGA,
Reach Compliance Codeunknown
ECCN code3A001.A.3
Other featuresFUNCTIONAL REDUNDANCY CHECK; DYNAMIC BRANCH PREDICTION; SYSTEM MANAGEMENT MODE; CONTROL ROM
Address bus width32
boundary scanYES
maximum clock frequency133 MHz
External data bus width64
FormatFLOATING POINT
Integrated cacheNO
JESD-30 codeS-CPGA-P387
low power modeNO
Number of DMA channels
Number of external interrupt devices3
Number of serial I/Os
Number of terminals387
On-chip data RAM width
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
RAM (number of words)0
speed133 MHz
Maximum slew rate3200 mA
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountNO
technologyBICMOS
Temperature levelCOMMERCIAL
Terminal formPIN/PEG
Terminal locationPERPENDICULAR
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR

BOXPODP5V-133 Related Products

BOXPODP5V-133 BOXPODP3V-125
Description Microprocessor, 133MHz, BICMOS, CPGA387 Microprocessor, 75MHz, BICMOS, CPGA387
Maker Intel Intel
package instruction PGA, PGA,
Reach Compliance Code unknown unknown
ECCN code 3A001.A.3 3A001.A.3
Address bus width 32 32
boundary scan YES YES
maximum clock frequency 133 MHz 75 MHz
External data bus width 64 64
Format FLOATING POINT FLOATING POINT
Integrated cache NO NO
JESD-30 code S-CPGA-P387 S-CPGA-P387
low power mode NO YES
Number of external interrupt devices 3 3
Number of terminals 387 387
Maximum operating temperature 70 °C 70 °C
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code PGA PGA
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified
speed 133 MHz 75 MHz
Maximum slew rate 3200 mA 4330 mA
Maximum supply voltage 5.25 V 3.6 V
Minimum supply voltage 4.75 V 3.135 V
Nominal supply voltage 5 V 3.3 V
surface mount NO NO
technology BICMOS BICMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form PIN/PEG PIN/PEG
Terminal location PERPENDICULAR PERPENDICULAR
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR
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