Multi-Port SRAM, 2KX8, 45ns, CMOS, PQCC52, PLASTIC, LCC-52
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | LCC |
| package instruction | QCCJ, |
| Contacts | 52 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 45 ns |
| Other features | INTERRUPT FLAG; ARBITER |
| JESD-30 code | S-PQCC-J52 |
| JESD-609 code | e0 |
| length | 19.1262 mm |
| memory density | 16384 bit |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 52 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2KX8 |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 19.1262 mm |
| IDT71V321S45J8 | IDT71V321L45PF8 | IDT71V321L45J | IDT71V321L45J8 | IDT71V321L45PF | IDT71V321S45J | IDT71V321S45PF | IDT71V321S45PF8 | |
|---|---|---|---|---|---|---|---|---|
| Description | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQCC52, PLASTIC, LCC-52 | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQFP64, PLASTIC, TQFP-64 | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQCC52, PLASTIC, LCC-52 | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQCC52, PLASTIC, LCC-52 | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQFP64, PLASTIC, TQFP-64 | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQCC52, PLASTIC, LCC-52 | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQFP64, PLASTIC, TQFP-64 | Multi-Port SRAM, 2KX8, 45ns, CMOS, PQFP64, PLASTIC, TQFP-64 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | LCC | QFP | LCC | LCC | QFP | LCC | QFP | QFP |
| package instruction | QCCJ, | LQFP, | PLASTIC, LCC-52 | QCCJ, | LQFP, QFP64,.66SQ,32 | QCCJ, LDCC52,.8SQ | LQFP, QFP64,.66SQ,32 | LQFP, |
| Contacts | 52 | 64 | 52 | 52 | 64 | 52 | 64 | 64 |
| Reach Compliance Code | compliant | compli | not_compliant | compliant | not_compliant | not_compliant | not_compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns |
| Other features | INTERRUPT FLAG; ARBITER | INTERRUPT FLAG; ARBITER | INTERRUPT FLAG; ARBITER | INTERRUPT FLAG; ARBITER | INTERRUPT FLAG; ARBITER | INTERRUPT FLAG; ARBITER | INTERRUPT FLAG; ARBITER | INTERRUPT FLAG; ARBITER |
| JESD-30 code | S-PQCC-J52 | S-PQFP-G64 | S-PQCC-J52 | S-PQCC-J52 | S-PQFP-G64 | S-PQCC-J52 | S-PQFP-G64 | S-PQFP-G64 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 19.1262 mm | 14 mm | 19.1262 mm | 19.1262 mm | 14 mm | 19.1262 mm | 14 mm | 14 mm |
| memory density | 16384 bit | 16384 bi | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 52 | 64 | 52 | 52 | 64 | 52 | 64 | 64 |
| word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | LQFP | QCCJ | QCCJ | LQFP | QCCJ | LQFP | LQFP |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | CHIP CARRIER | FLATPACK, LOW PROFILE | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE | CHIP CARRIER | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 | 240 | 225 | 225 | 240 | 225 | 240 | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.572 mm | 1.6 mm | 4.572 mm | 4.572 mm | 1.6 mm | 4.572 mm | 1.6 mm | 1.6 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN LEAD |
| Terminal form | J BEND | GULL WING | J BEND | J BEND | GULL WING | J BEND | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm | 0.8 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maximum time at peak reflow temperature | 30 | 20 | 30 | 30 | 20 | 30 | 20 | 20 |
| width | 19.1262 mm | 14 mm | 19.1262 mm | 19.1262 mm | 14 mm | 19.1262 mm | 14 mm | 14 mm |
| Maker | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Humidity sensitivity level | - | 3 | 1 | - | 3 | 1 | 3 | 3 |
| Minimum standby current | - | 2 V | 2 V | 2 V | 2 V | 3 V | 3 V | - |