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KS310-85TG3M

Description
IC Socket, DIP10, 10 Contact(s),
CategoryThe connector    socket   
File Size158KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

KS310-85TG3M Overview

IC Socket, DIP10, 10 Contact(s),

KS310-85TG3M Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codecompliant
ECCN codeEAR99
Contact to complete cooperationGOLD OVER NICKEL
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBERYLLIUM COPPER/COPPER ALLOY
Device slot typeIC SOCKET
Type of equipment usedDIP10
Shell materialPOLYIMIDE
JESD-609 codee0
Number of contacts10
DIP Sockets
Table of Models
Peel-A-Way DIP Socket Terminal Carriers
®
Description:
Peel-A-Way
®
Socket (KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
.005
(.13)
Polyimide
Film
For molded insulators, see pages 28-29.
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
Features:
• Peel away terminal carrier after
soldering.
• Disposable carrier.
• Complete soldering visibility on
both sides of PCB.
• Maximum air flow.
• Better flux rinse.
• No contact damage due to
terminal carrier insertion.
• No contact pull out due to
extraction of terminal carrier.
(shown here on
molded socket)
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
See pg. 29 for intrusive reflow application.
Tin/Lead: Type -111
Lead-free: Type -810
Peel-A-Way
®
only
.072 Dia.
(1.83)
.130
(3.30)
.058 Dia.
(1.47)
Tin/Lead: Type -151
Lead-free: Type -812
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.031
(.79)
.155
(3.94)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
.038 Dia.
(.97)
How To Order
KS
Body Type
RoHS Compliant Insulators:
3
16
- 85
M
G
Contact Plating
RoHS Compliant:
KS - Peel-A-Way
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)
Number of Pins
(8 to 64)
Additional sizes available - consult factory.
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
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