DPST, 2 Func, BIPolar, CDIP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Vishay |
| Parts packaging code | DIP |
| package instruction | DIP, DIP14,.3 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | DPST |
| JESD-30 code | R-XDIP-T14 |
| JESD-609 code | e0 |
| normal position | NO |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -20 °C |
| output | SEPARATE OUTPUT |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| Maximum connection time | 1000 ns |
| switch | MAKE-BEFORE-BREAK |
| technology | BIPOLAR |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |

| DG129BP | DG126AL/883 | DG126AP | DG126BP | DG140BP | |
|---|---|---|---|---|---|
| Description | DPST, 2 Func, BIPolar, CDIP14, | DPST, 2 Func, BIPolar, CDFP14 | Multiplexers/Switches | Multiplexers/Switches | DPST, 2 Func, CDIP14 |
| package instruction | DIP, DIP14,.3 | DFP, FL14,.3 | , | , | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Is it Rohs certified? | incompatible | incompatible | - | - | incompatible |
| Analog Integrated Circuits - Other Types | DPST | DPST | - | - | DPST |
| JESD-30 code | R-XDIP-T14 | R-XDFP-F14 | - | - | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | - | - | e0 |
| normal position | NO | NO | - | - | NO |
| Number of functions | 2 | 2 | - | - | 2 |
| Number of terminals | 14 | 14 | - | - | 14 |
| Maximum operating temperature | 85 °C | 125 °C | - | - | 85 °C |
| Minimum operating temperature | -20 °C | -55 °C | - | - | -20 °C |
| output | SEPARATE OUTPUT | SEPARATE OUTPUT | - | - | SEPARATE OUTPUT |
| Package body material | CERAMIC | CERAMIC | - | - | CERAMIC |
| encapsulated code | DIP | DFP | - | - | DIP |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | - | - | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | - | - | IN-LINE |
| Certification status | Not Qualified | Not Qualified | - | - | Not Qualified |
| surface mount | NO | YES | - | - | NO |
| Maximum connection time | 1000 ns | 600 ns | - | - | 1500 ns |
| switch | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | - | - | MAKE-BEFORE-BREAK |
| Temperature level | OTHER | MILITARY | - | - | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | FLAT | - | - | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | - | - | 2.54 mm |
| Terminal location | DUAL | DUAL | - | - | DUAL |
| Base Number Matches | - | 1 | 1 | 1 | - |