LD-001 Series
LED displays
Flat displays
LD-001 Series
The LD-001 series were designed in
response to the need for medium-sized, flat
displays. These are two-chip, flat displays
with high luminance.
!
External dimensions
(Units : mm)
10.7
+0
−0.1
9.5±0.1
4.5±0.1
+0
5.7
−0.1
2°
0.6
5.0±0.5
!
Features
1) 4.5 x 9.5 mm planar emission from two
chips connected in series.
2) High luminance, uniform emission.
3) Four colors : red, orange, yellow and
green.
Cathode mark
Max.0.8
Pin No.1 2 3
(2.5) (2.5)
0.6
5.6±0.1
Pin No.1
2
Tolerances are
±
0.3 unless otherwise noted:
!
Selection guide
Emitting color
Type
∗Order-based
production.
Red
LD-001VR
Orange
LD-001DU
∗
Yellow
LD-001YY
∗
Green
LD-001MG
!
Absolute maximum ratings
(Ta = 25°C)
Parameter
Power dissipation
Forward current
Peak forward
current
Reverse voltage
Operating
temperature
Storage
temperature
Symbol
P
D
I
F
I
FP
V
R
Topr
Tstg
Red
LD-001VR Orange LD-001DU Yellow LD-001YY
120
20
60
∗
3
120
20
60
∗
3
−25~+75
−30~+85
120
20
60
∗
3
Green LD-001MG
150
25
60
∗
3
Unit
mW
mA
mA
V
°C
°C
∗
Pulse width 1ms duty 1 / 5
0.3
3
(1.8)
R4
LD-001 Series
LED displays
!
Electrical and optical characteristics
(Ta = 25°C)
Parameter
Forward voltage
Reverse current
Peak wavelength
Spectral line half
width
Symbol Conditions
V
F
I
R
λ
P
∆λ
I
F
=
10mA
V
R
=
3V
I
F
=
10mA
I
F
=
10mA
Red
−
−
−
−
−
−
−
−
Orange
−
−
−
−
Yellow
−
−
−
−
Green
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
2.0
−
650
40
2.8
10
−
−
2.0
−
610
40
2.8
10
−
−
2.1
−
585
40
2.8
10
−
−
2.1
−
563
40
2.8
10
−
−
Unit
V
µA
nm
nm
Electrical and optical values are guaranteed values per element.
!Luminous
intensity vs. wavelength
1.0
Axial Luminous Intensity
0.8
0.6
0.4
0.2
0
500
Green
Yellow
Orange
Red
550
600
650
700
750
Wavelength :
λ
P
(nm)
!
Luminous intensity
Color
Red
Orange
Yellow
Green
Type
LD-001VR
LD-001DU
LD-001YY
LD-001MG
Min.
2.2
2.2
1.4
3.6
Typ.
6.3
6.3
4.0
10
Max.
−
−
−
−
Unit
mcd
mcd
mcd
mcd
Note 1: Measured at I
F
= 10mA
Note 2: Current passes through 2 elements in series.
!
Operation notes
When forming leads, the bend should be at least 2mm from the base of the package. Solder after forming the leads, and
ensure that the inside of the LED is not subjected to mechanical stress while it is hot.
Embedded System
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