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PCF8574PN

Description
IC 8 I/O, PIA-GENERAL PURPOSE, PDIP16, 0.300 INCH, LEAD FREE, PLASTIC, SOT-38-4, DIP-16, Parallel IO Port
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size128KB,24 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

PCF8574PN Overview

IC 8 I/O, PIA-GENERAL PURPOSE, PDIP16, 0.300 INCH, LEAD FREE, PLASTIC, SOT-38-4, DIP-16, Parallel IO Port

PCF8574PN Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Reach Compliance Codeunknown
ECCN codeEAR99
maximum clock frequency0.1 MHz
External data bus width1
JESD-30 codeR-PDIP-T16
JESD-609 codee4
length19.025 mm
Number of digits8
Number of I/O lines8
Number of ports1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/5 V
Certification statusNot Qualified
Maximum seat height4.2 mm
Maximum slew rate0.1 mA
Maximum supply voltage6 V
Minimum supply voltage2.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE
INTEGRATED CIRCUITS
DATA SHEET
PCF8574
Remote 8-bit I/O expander for
I
2
C-bus
Product specification
Supersedes data of 2002 Jul 29
2002 Nov 22

PCF8574PN Related Products

PCF8574PN PCF8574APN PCF8574ATD-T PCF8574TDK-T PCF8574TD-T PCF8574ATDK-T
Description IC 8 I/O, PIA-GENERAL PURPOSE, PDIP16, 0.300 INCH, LEAD FREE, PLASTIC, SOT-38-4, DIP-16, Parallel IO Port IC 8 I/O, PIA-GENERAL PURPOSE, PDIP16, 0.300 INCH, LEAD FREE, PLASTIC, SOT-38-4, DIP-16, Parallel IO Port IC 8 I/O, PIA-GENERAL PURPOSE, PDSO16, 7.50 MM, LEAD FREE, PLASTIC, MS-013, SOT-162-1, SO-16, Parallel IO Port IC 8 I/O, PIA-GENERAL PURPOSE, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT-266-1, SSOP-20, Parallel IO Port IC 8 I/O, PIA-GENERAL PURPOSE, PDSO16, 7.50 MM, LEAD FREE, PLASTIC, MS-013, SOT-162-1, SO-16, Parallel IO Port IC IC,I/O PORT,8-BIT,CMOS,SSOP,20PIN,PLASTIC, Parallel IO Port
Maker NXP NXP NXP NXP NXP NXP
package instruction DIP, DIP16,.3 DIP, SOP, LSSOP, SOP, SSOP, SSOP20,.25
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G20 R-PDSO-G16 R-PDSO-G20
JESD-609 code e4 e4 e4 e4 e4 e3
Number of terminals 16 16 16 20 16 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP LSSOP SOP SSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD MATTE TIN
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 0.65 mm 1.27 mm 0.635 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Source Url Status Check Date 2013-06-14 00:00:00 2013-06-14 00:00:00 - 2013-06-14 00:00:00 - 2013-06-14 00:00:00
Parts packaging code DIP DIP SOIC SSOP SOIC -
Contacts 16 16 16 20 16 -
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 -
maximum clock frequency 0.1 MHz 0.1 MHz 0.1 MHz - 0.1 MHz -
External data bus width 1 1 1 - 1 -
length 19.025 mm 19.025 mm 10.3 mm 6.5 mm 10.3 mm -
Number of I/O lines 8 8 8 8 8 -
Number of ports 1 1 1 1 1 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED 245 NOT SPECIFIED - NOT SPECIFIED 225
Maximum seat height 4.2 mm 4.2 mm 2.65 mm 1.5 mm 2.65 mm -
Maximum slew rate 0.1 mA 0.1 mA 0.1 mA - 0.1 mA -
Maximum supply voltage 6 V 6 V 6 V 6 V 6 V -
Minimum supply voltage 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V -
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V -
Maximum time at peak reflow temperature NOT SPECIFIED 40 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 7.5 mm 4.4 mm 7.5 mm -
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE -
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