GS88236B-11T datasheet, PDF - EEWORLD Datasheet

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GS88236B-11T: DescriptionCache SRAM, 256KX36, 11ns, CMOS, PBGA119, BGA-119; Categorystorage storage; File Size1MB，39 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS88236B-11T Overview

Cache SRAM, 256KX36, 11ns, CMOS, PBGA119, BGA-119

GS88236B-11T Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	BGA, BGA119,7X17,50
Contacts	119
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	11 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O type	COMMON
JESD-30 code	R-PBGA-B119
JESD-609 code	e0
length	22 mm
memory density	9437184 bit
Memory IC Type	CACHE SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	119
word count	262144 words
character code	256000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum standby current	0.03 A
Minimum standby current	3.14 V
Maximum slew rate	0.225 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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Preliminary

GS88218/36B-11/11.5/100/80/66

119-Bump BGA

Commercial Temp

Industrial Temp

Features

• FT pin for user-configurable flow through or pipeline operation

• Single/Dual Cycle Deselect Selectable

• IEEE 1149.1 JTAG Compatible Boundary Scan

• On-chip write parity checking; even or odd selectable

• ZQ mode pin for user-selectable high/low output drive strength

• x16/x32 mode with on-chip parity encoding and error detection

• 3.3 V +10%/–5% core power supply

• 2.5 V or 3.3 V I/O supply

• LBO pin for Linear or Interleaved Burst mode

• Internal input resistors on mode pins allow floating mode pins

• Default to SCD x18/x36 Interleaved Pipelined mode

• Byte Write (BW) and/or Global Write (GW) operation

• Common data inputs and data outputs

• Clock Control, registered, address, data, and control

• Internal self-timed write cycle

• Automatic power-down for portable applications

•

119-bump BGA package

-11

-11.5

-100

-80

-66

10 ns

10 ns 12.5 ns 15 ns

Pipeline tCycle 10 ns

4.0 ns 4.0 ns 4.0 ns 4.5 ns

5 ns

3-1-1-1

225 mA 225 mA 225 mA 200 mA 185 mA

512K x 18, 256K x 36 ByteSafe™

100 MHz–66 MHz

3.3 V V

8Mb S/DCD Sync Burst SRAMs

3.3 V and 2.5 V I/O

on every cycle with no degradation of chip performance.

Flow Through/Pipeline Reads

The function of the Data Output Register can be controlled by

the user via the FT mode bump (Bump 5R). Holding the FT

mode pin low places the RAM in Flow Through mode, causing

output data to bypass the Data Output Register. Holding FT

high places the RAM in Pipeline mode, activating the rising-

edge-triggered Data Output Register.

SCD and DCD Pipelined Reads

The GS88218/36B is a SCD (Single Cycle Deselect) and DCD

(Dual Cycle Deselect) pipelined synchronous SRAM. DCD

SRAMs pipeline disable commands to the same degree as read

commands. SCD SRAMs pipeline deselect commands one

stage less than read commands. SCD RAMs begin turning off

their outputs immediately after the deselect command has been

captured in the input registers. DCD RAMs hold the deselect

command for one full cycle and then begin turning off their

outputs just after the second rising edge of clock. The user may

configure this SRAM for either mode of operation using the

SCD mode input on Bump 4L.

Byte Write and Global Write

Byte write operation is performed by using Byte Write enable

(BW) input combined with one or more individual byte write

signals (Bx). In addition, Global Write (GW) is available for

writing all bytes at one time, regardless of the Byte Write

control inputs.

Flow

Through

2-1-1-1

11 ns 11.5 ns 12 ns

14 ns

18 ns

15 ns

20 ns

tCycle 15 ns

180 mA 180 mA 180 mA 175 mA 165 mA

Functional Description

Applications

The GS88218/36B is a 9,437,184-bit high performance

synchronous SRAM with a 2-bit burst address counter.

Although of a type originally developed for Level 2 Cache

applications supporting high performance CPUs, the device

now finds application in synchronous SRAM applications,

ranging from DSP main store to networking chip set support.

ByteSafe™ Parity Functions

The GS88218/36B features ByteSafe data security functions.

See

“ByteSafe™ Parity Functions” on page 8

for further

information.

FLXDrive™

The ZQ pin allows selection between high drive strength (ZQ

low) for multi-drop bus applications and normal drive strength

(ZQ floating or high) point-to-point applications. See the

Output Driver Characteristics chart on page 38

for details.

Controls

Addresses, data I/Os, chip enables (E1 and E2), address burst

control inputs (ADSP, ADSC, ADV), and write control inputs

(Bx, BW, GW) are synchronous and are controlled by a

positive-edge-triggered clock input (CK). Output enable (G)

and power down control (ZZ) are asynchronous inputs. Burst

cycles can be initiated with either ADSP or ADSC inputs. In

Burst mode, subsequent burst addresses are generated

internally and are controlled by ADV. The burst address

counter may be configured to count in either linear or

interleave order with the Linear Burst Order (LBO) input. The

Burst function need not be used. New addresses can be loaded

Rev: 1.15 5/2001

1/39

Sleep Mode

Low power (Sleep mode) is attained through the assertion

(High) of the ZZ signal, or by stopping the clock (CK).

Memory data is retained during Sleep mode.

Core and Interface Voltages

The GS88218/36B operates on a 3.3 V power supply and all

inputs/outputs are 3.3 V- and 2.5 V-compatible. Separate

output power (V

DDQ

) pins are used to decouple output noise

from the internal circuit.

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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