Flash Module, 2MX8, 100ns, CPGA50, DENSE STACK, MODULE, HERMETIC SEALED, PGA-50
| Parameter Name | Attribute value |
| Maker | B&B Electronics Manufacturing Company |
| Parts packaging code | PGA |
| package instruction | DENSE STACK, MODULE, HERMETIC SEALED, PGA-50 |
| Contacts | 50 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 100 ns |
| Other features | AUTOMATIC WRITE |
| Spare memory width | 16 |
| JESD-30 code | R-CPGA-P50 |
| length | 25.146 mm |
| memory density | 16777216 bit |
| Memory IC Type | FLASH MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 50 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | APGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, PIGGYBACK |
| Parallel/Serial | PARALLEL |
| Programming voltage | 12 V |
| Certification status | Not Qualified |
| Maximum seat height | 7.4676 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| type | NOR TYPE |
| width | 13.716 mm |
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